EP4SGX290FH29C2XN

IC FPGA 289 I/O 780HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 17661952 291200 780-BBGA, FCBGA

Quantity 355 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290FH29C2XN – Stratix® IV GX FPGA, 291,200 Logic Elements

The EP4SGX290FH29C2XN is a Stratix IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780-BBGA FCBGA package for surface-mount assembly. It combines a high logic element count with substantial on-chip memory and advanced I/O capabilities to address high-bandwidth, protocol-rich designs.

Targeted at commercial applications that require dense programmable logic, embedded memory and flexible I/O, this device is supported by the Stratix IV device handbook and associated architecture references for system integration, clocking and transceiver features.

Key Features

  • Core Logic — 291,200 logic elements (cells) provide a high-density fabric for complex custom logic implementations.
  • Embedded Memory — Approximately 17.66 Mbits of on-chip RAM (17,661,952 total RAM bits) for buffering, packet storage and local data handling.
  • I/O Capacity — Up to 289 general-purpose I/O pins to support broad interfacing requirements and multiple external peripherals.
  • High‑Speed Transceiver and I/O Features — Stratix IV GX series device handbook documents high-speed differential I/O, transceiver capabilities and features such as DPA and soft-CDR for protocol support and signal integrity.
  • Clocking and PLLs — Device family documentation describes dedicated clock networks and PLL resources to support multi-clock systems and high-performance timing architectures.
  • Package and Mounting — 780-BBGA (FCBGA) package, supplier device package listed as 780-HBGA (33×33), designed for surface-mount assembly.
  • Power — Core voltage supply range specified at 870 mV to 930 mV to match platform power rails and regulator designs.
  • Operating Conditions and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High‑bandwidth Communications — Implement protocol engines, SERDES interfaces and packet-processing logic that leverage the device’s transceiver features and large logic fabric.
  • Signal Processing and DSP — Use embedded memory and the Stratix IV DSP-oriented architecture elements for real-time filtering, encoding/decoding and media processing.
  • External Memory Interfaces — Implement controllers and custom memory interfaces using available I/O resources and device clocking networks.
  • Custom Accelerator Logic — Deploy compute- or offload-oriented accelerators that require high logic density and local RAM for intermediate data storage.

Unique Advantages

  • High Logic Density: 291,200 logic elements enable integration of complex systems-on-FPGA without immediate need for multiple devices.
  • Substantial On‑Chip Memory: Approximately 17.66 Mbits of embedded RAM reduces external memory dependence for many buffering and scratchpad needs.
  • Rich I/O and Transceiver Support: 289 I/O pins paired with Stratix IV GX transceiver features support diverse protocol and interface requirements.
  • Platform‑Level Clocking: Dedicated clock networks and PLL resources documented for the Stratix IV family help implement robust multi-clock designs.
  • Commercial‑Grade Reliability: Specified operating range (0 °C to 85 °C) and RoHS compliance suit mainstream commercial applications and manufacturing processes.
  • Compact, Surface‑Mount Package: 780-BBGA (33×33 supplier package) provides a high I/O footprint in a single, mountable package for compact system boards.

Why Choose EP4SGX290FH29C2XN?

The EP4SGX290FH29C2XN positions itself as a high-density Stratix IV GX FPGA for commercial systems that demand significant programmable logic, embedded memory and broad I/O capability. Its documented family features—high-speed transceivers, clocking resources and DSP-oriented architecture—align with designs that require protocol flexibility and sustained data throughput.

This device is suited for engineers building high‑bandwidth communications equipment, media and signal-processing subsystems, or custom accelerators where on-chip RAM, dense logic and mature device documentation support scalable development and integration.

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