EP4SGX290FH29C3G

The EP4SGX290FH29C3G is a Stratix IV family Field Programmable Gate Array (FPGA) IC from Intel, offered in a high-density FCBGA package for surface-mount applications. It provides a large programmable fabric and on-chip resources suited for high-throughput logic, memory-intensive designs, and dense I/O requirements in commercial applications.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory, and 289 user I/O pins, this device targets designs that require substantial logic capacity, embedded RAM, and high I/O density while operating within a commercial temperature range.

Key Features

• Core Capacity — 291,200 logic elements for implementing complex programmable logic, custom datapaths, and large finite-state systems.
• Embedded Memory — Approximately 17.66 Mbits of on-chip RAM to support buffering, LUT-based memory, and local data storage within the FPGA fabric.
• I/O Density — 289 configurable I/O pins to accommodate multiple external interfaces and parallel data connections.
• Stratix IV Architecture — Device design and feature set documented in the Stratix IV device handbook, including architecture, I/O, PLLs, and transceiver capabilities.
• Package and Mounting — Available in a 780-ball FCBGA / 780-BBGA package (supplier package: 780-HBGA, 33 × 33); surface-mount mounting for compact board integration.
• Power — Core supply specification of 870 mV to 930 mV to match platform power-rail requirements.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard commercial environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed communications — Implement protocol bridging, parallel and serial datapaths, and interface logic using the device’s high logic capacity and documented transceiver/I/O features.
• Signal processing and DSP acceleration — Use embedded memory and the programmable fabric to implement buffering, pipelined datapaths, and custom processing blocks.
• External memory interfaces — Integrate with external memory devices and controllers leveraging on-chip resources and documented memory interface features.
• Custom control and data-path logic — Replace or augment ASICs and discrete logic with programmable implementations for flexible, updateable designs.

Unique Advantages

• Large programmable fabric: 291,200 logic elements provide capacity for complex logic implementations and system consolidation.
• Substantial embedded memory: Approximately 17.66 Mbits of on-chip RAM reduces external memory dependence and supports high-bandwidth buffering.
• High I/O count: 289 I/O pins enable multiple parallel interfaces and dense external connectivity without additional logic chips.
• Commercial package options: 780-ball FCBGA / 780-BBGA (780-HBGA, 33 × 33) simplifies board layout for compact, surface-mounted system designs.
• Documented architecture: Stratix IV device handbook provides technical detail on fabric, I/O, PLLs, and transceiver features to support development and verification.
• Regulatory compliance: RoHS compliance supports use in lead-free manufacturing flows.

Why Choose EP4SGX290FH29C3G?

The EP4SGX290FH29C3G delivers a combination of high logic capacity, sizable embedded memory, and extensive I/O in a commercial-grade Stratix IV FPGA package. It is positioned for engineering teams needing a programmable platform that consolidates multiple functions—data-path processing, memory buffering, and dense interfacing—onto a single device.

This device is well suited for commercial systems where documented architecture, on-chip resources, and package compactness support scalable designs and streamlined BOMs. Intel’s Stratix IV documentation included with the device helps accelerate integration and verification for complex applications.

Request a quote or submit an inquiry to receive pricing and availability for EP4SGX290FH29C3G and to discuss how this FPGA can fit your upcoming design requirements.