EP4SGX290FH29C3

IC FPGA 289 I/O 780HBGA
Part Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 289 17661952 291200 780-BBGA, FCBGA

Quantity 872 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O289Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11648Number of Logic Elements/Cells291200
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits17661952

Overview of EP4SGX290FH29C3 – Stratix IV GX FPGA, 291,200 logic elements, ~17.66 Mbits embedded memory, 289 I/Os, 780‑BBGA (FCBGA)

The EP4SGX290FH29C3 is a Stratix® IV GX Field Programmable Gate Array (FPGA) packaged in a 780‑ball BGA (FCBGA). It delivers a high logic capacity and substantial on‑chip RAM, plus a large I/O count suitable for board‑level integration.

Targeted at designs that require dense programmable logic, significant embedded memory, and extensive I/O connectivity, this commercial‑grade device supports a 0 °C to 85 °C operating range and RoHS compliance for environmentally conscious system design.

Key Features

  • High Logic Capacity — 291,200 logic elements provide substantial programmable resource for complex digital systems and multi‑function consolidation.
  • Embedded Memory — Approximately 17.66 Mbits of on‑chip RAM enable buffering, packet storage and intermediate data handling without external memory.
  • I/O and Packaging — 289 user I/Os in a 780‑ball BGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33) for straightforward board footprint planning. Surface‑mount mounting type simplifies PCB assembly.
  • Power and Temperature — Core voltage supply range of 870 mV to 930 mV and a commercial operating temperature range of 0 °C to 85 °C, allowing designers to plan power delivery and thermal management precisely.
  • Series‑level System Blocks — The Stratix IV device handbook documents series features such as transceiver performance, PLL specifications, DSP block specifications and TriMatrix memory block specifications, providing architecture‑level details for system design.
  • Compliance — RoHS compliant, supporting regulatory and environmental requirements for many commercial products.

Typical Applications

  • High‑density logic designs — Consolidate complex control, glue logic and custom data paths within a single FPGA using the device’s large pool of logic elements.
  • Signal processing and DSP acceleration — Leverage the Stratix IV series DSP block specifications for compute‑intensive signal processing tasks and algorithm acceleration.
  • High‑I/O board systems — Use the 289 I/Os and FCBGA package for dense, board‑level interfacing including parallel and low‑pin‑count peripheral connectivity.
  • Transceiver‑enabled communications — Designs that require transceiver functionality can reference the series’ transceiver performance specifications to architect serial links and high‑speed I/O.

Unique Advantages

  • High integration density: 291,200 logic elements reduce the need for multiple devices and simplify system BOMs.
  • Significant on‑chip memory: Approximately 17.66 Mbits of embedded RAM supports larger data buffers and on‑chip storage for lower latency operations.
  • Extensive I/O: 289 I/Os provide flexibility to connect to a wide range of peripherals and interfaces without external expanders.
  • Package options for reliable assembly: 780‑BBGA (FCBGA) / supplier 780‑HBGA (33×33) package supports standard surface‑mount PCB assembly processes.
  • Clear power and thermal parameters: Defined core voltage range (870 mV–930 mV) and commercial temperature rating (0 °C–85 °C) aid in power‑delivery and thermal design decisions.
  • Series documentation available: Stratix IV device handbook includes detailed PLL, transceiver, DSP and TriMatrix memory block specifications to guide system integration.

Why Choose EP4SGX290FH29C3?

The EP4SGX290FH29C3 positions itself as a high‑capacity Stratix IV GX FPGA option for commercial designs that demand large programmable logic resources, substantial embedded memory, and broad I/O capability. Its documented series‑level building blocks—transceivers, PLLs, DSPs and memory matrices—support the system‑level choices needed for advanced digital, signal processing and communications applications.

This device suits engineering teams seeking to consolidate functions on a single FPGA, reduce external component counts, and rely on clearly specified power and thermal envelopes. RoHS compliance and standard surface‑mount packaging further simplify integration into commercial product lines.

Request a quote or submit an RFQ for EP4SGX290FH29C3 to receive pricing and availability information tailored to your project requirements.

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