EP4SGX290FH29I4

The EP4SGX290FH29I4 is a Stratix IV GX family Field Programmable Gate Array (FPGA) IC from Intel, designed for demanding, high‑density programmable logic applications. It combines a large logic fabric with substantial embedded memory and a broad set of I/O resources suitable for bandwidth‑oriented designs.

Typical use cases include high‑performance communications, DSP‑centric systems and designs that require extensive I/O and memory integration. The device’s architecture and operating ranges support deployment in industrial environments where temperature and power characteristics are critical design constraints.

Key Features

• Logic Fabric — 291,200 logic elements for implementing large, complex digital designs and custom accelerators.
• Embedded Memory — Approximately 16.8 Mbits of on‑chip RAM to support buffering, lookup tables and local storage for DSP and packet processing tasks.
• I/O Resources — 289 user I/O pins to interface with external peripherals, memory, and high‑speed interfaces.
• Stratix IV GX Architecture — Device family features include high‑speed transceiver capabilities, DSP blocks, PLLs and hierarchical clock networks as described in the device handbook.
• Power Supply — Operates from 870 mV to 930 mV core supply, enabling predictable power budgeting and board‑level design.
• Package & Mounting — 780‑BBGA, FCBGA package; supplier device package listed as 780‑HBGA (33×33). Surface‑mount device for standard PCB assembly.
• Thermal & Environmental — Industrial temperature grade with an operating range of −40°C to 100°C; RoHS compliant for regulatory conformance.

Typical Applications

• High‑Speed Communications — Leverages the Stratix IV GX device family’s transceiver and high aggregate bandwidth capabilities for network equipment and protocol bridging.
• Signal Processing & DSP — Large logic array and on‑chip RAM support DSP blocks and algorithm acceleration for video, radar or telecom processing.
• External Memory Interfaces — Suitable for designs that require robust external memory control and high‑throughput data movement.
• Industrial Automation — Industrial temperature rating and extensive I/O make the device appropriate for control systems, motion control and industrial networking.

Unique Advantages

• High Logic Density: 291,200 logic elements allow integration of complex subsystems on a single FPGA, reducing board count and interconnect complexity.
• Substantial Embedded Memory: Approximately 16.8 Mbits of on‑chip RAM enables large buffers and local data storage for high‑throughput applications.
• Comprehensive I/O: 289 I/O pins provide flexible interfacing options for peripherals, sensors and external memory devices.
• Industrial Temperature Range: Rated for −40°C to 100°C to support deployment in temperature‑sensitive industrial environments.
• FCBGA Packaging: 780‑BBGA package supports a compact board footprint while providing high pin count for dense system designs.
• Standards‑aware Device Family: Stratix IV GX family features such as transceivers, PLLs and clock networks give designers access to proven architecture elements described in the device handbook.

Why Choose EP4SGX290FH29I4?

The EP4SGX290FH29I4 positions itself as a high‑density, industrial‑grade FPGA for applications that demand significant programmable logic, on‑chip memory and broad I/O connectivity. Its Stratix IV GX architecture elements — including transceiver and DSP‑oriented features described in the device handbook — make it suitable for system designs focused on bandwidth, signal processing and external memory interfacing.

Designers and procurement teams seeking a robust, factory‑documented device from Intel will find the EP4SGX290FH29I4 appropriate for complex embedded systems where long‑term scalability and integration are priorities.

Request a quote to check pricing and availability or submit an inquiry for technical and procurement assistance with the EP4SGX290FH29I4.