EP4SGX290HF35C3N

The EP4SGX290HF35C3N is a Stratix® IV GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable logic fabric combined with substantial on-chip memory and a large I/O count for complex digital designs.

With 291,200 logic elements, approximately 17.66 Mbits of embedded memory and 564 I/O pins in a 1152-BBGA FCBGA package, this device is suited to applications that require significant integration of logic, memory and interfacing in a surface-mount form factor.

Key Features

• Core logic — 291,200 logic elements to implement large or highly parallel digital designs.
• Embedded memory — Approximately 17.66 Mbits of on-chip RAM for buffering, packet storage and state machines.
• I/O density — 564 user I/O pins to support extensive peripheral and bus connectivity.
• Power requirements — Core supply range of 870 mV to 930 mV to match system power architectures.
• Package & mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount PCB assembly.
• Operating conditions — Commercial grade device specified for 0°C to 85°C operation.
• Environmental compliance — RoHS compliant for global electronics assembly requirements.

Unique Advantages

• High integration of logic and memory: Large logic element count and substantial embedded RAM reduce the need for external memory and discrete logic, simplifying board design.
• Extensive I/O capability: 564 I/Os provide flexibility for multiple parallel interfaces, sensors, and external peripherals without additional I/O expanders.
• Compact, surface-mount FCBGA footprint: The 1152-FBGA (35×35) package enables dense system layouts while maintaining robust connectivity.
• Tight core power range: Defined 870 mV–930 mV supply window supports consistent power budgeting and system-level power planning.
• Commercial temperature suitability: Rated for 0°C–85°C operation to match a wide range of commercial and industrial-adjacent applications.
• RoHS compliance: Meets common environmental requirements for modern electronics manufacturing.

Why Choose EP4SGX290HF35C3N?

The EP4SGX290HF35C3N combines high logic density, significant embedded memory and a large I/O count in a compact FCBGA package, offering a balanced platform for complex, integration-focused designs. Its defined core voltage range and commercial temperature rating provide clear system-level parameters for power and thermal design.

This device is well suited to teams and projects that require substantial programmable logic and on-chip memory in a surface-mount FPGA package, delivering a scalable foundation for advanced digital designs while aligning with RoHS manufacturing requirements.

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