EP4SGX290HF35C4N

The EP4SGX290HF35C4N is a Stratix® IV GX Field Programmable Gate Array (FPGA) from Intel designed for high-density, commercial programmable logic applications. It provides a large logic fabric and substantial on-chip memory in a compact surface-mount FCBGA package, addressing designs that demand many logic elements and extensive I/O connectivity.

This device is targeted at commercial systems that require high logic capacity, extensive embedded memory, and a large number of I/O pins while operating within a commercial temperature range and low-voltage core supply.

Key Features

• Logic Capacity  Approximately 291,200 logic elements for implementing complex digital designs and custom hardware functions.
• Embedded Memory  Approximately 17,661,952 bits (≈16.9 Mbits) of on-chip RAM to support buffering, data staging, and on-device storage of intermediate results.
• I/O Density  564 I/O pins to support high-pin-count interfaces and dense connectivity to external devices and subsystems.
• Package and Mounting  1152-BBGA (1152-FBGA, 35×35) package in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling operation within a defined low-voltage domain.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial applications.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density digital processing  Use the large logic element count to implement complex custom datapaths, state machines, and hardware accelerators in commercial systems.
• Multi-channel I/O aggregation  Leverage 564 I/Os to consolidate many external interfaces, enabling dense connectivity for communication and control subsystems.
• On-chip buffering and memory functions  Embedded memory capacity supports local buffering, packet staging, and temporary data storage within the FPGA fabric.
• Compact board-level integration  The 1152-BBGA surface-mount package fits space-constrained commercial designs that require high gate density and I/O count.

Unique Advantages

• High programmable capacity: Approximately 291,200 logic elements let designers implement sophisticated logic and parallel processing structures on a single device.
• Substantial on-chip memory: About 17.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage tasks.
• Extensive connectivity: 564 I/Os provide flexibility for multi-channel interfaces, sensor arrays, or high-pin-count peripheral integration.
• Compact FCBGA package: 1152-FBGA (35×35) surface-mount package enables dense, board-level integration while supporting high I/O count.
• Commercial operating range: Rated 0 °C to 85 °C and RoHS compliant, making the device suitable for mainstream commercial product deployments.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV supports designs targeting low-voltage FPGA power domains.

Why Choose EP4SGX290HF35C4N?

The EP4SGX290HF35C4N combines a large logic fabric, significant embedded memory, and a high I/O count in a compact surface-mount FCBGA package, positioning it for commercial designs that require substantial on-chip resources and dense connectivity. Its commercial temperature rating and RoHS compliance make it suitable for mainstream product deployments.

This FPGA is appropriate for engineering teams building complex programmable logic solutions—where integration density, on-chip memory, and numerous external interfaces are primary design drivers. Choosing this device provides a high-capacity, vendor-backed FPGA option for scaling designs that need substantial logic and memory within a commercial-grade footprint.

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