EPF8452ATC100-4N
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 68 336 100-TQFP |
|---|---|
| Quantity | 254 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 68 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 42 | Number of Logic Elements/Cells | 336 | ||
| Number of Gates | 4000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8452ATC100-4N – FLEX 8000 Field Programmable Gate Array (FPGA) IC 68 I/O, 336 Logic Elements, 100‑TQFP
The EPF8452ATC100-4N is an Intel FLEX 8000 family field programmable gate array supplied in a 100‑pin TQFP (14 × 14 mm) surface‑mount package. This commercial‑grade device targets embedded control, interface and glue‑logic applications that require a moderate density of programmable logic and a 5 V supply domain.
Designed for system integration, the device provides approximately 4,000 usable gates and 336 logic elements with 68 user I/O pins, delivering a compact, configurable solution for board‑level function consolidation and interface implementation.
Key Features
- Logic Capacity Approximately 4,000 gates and 336 logic elements provide moderate density programmable logic for control, glue logic, and bus interface tasks.
- I/O and Voltage 68 user I/O pins with a specified supply range of 4.75 V to 5.25 V, suitable for 5.0 V system environments.
- Memory No embedded on‑chip RAM (Total RAM bits: 0), making the device focused on combinational and registered logic implementations.
- Package and Mounting 100‑pin TQFP (14 × 14 mm) surface‑mount package for compact PCB layouts and conventional assembly processes.
- Temperature and Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C for standard commercial applications.
- Regulatory/Environmental RoHS compliant to support lead‑free manufacturing requirements.
- FLEX 8000 Family Architecture As a member of the FLEX 8000 family, the platform benefits from family features such as in‑circuit reconfigurability (ICR) via external configuration devices, FastTrack interconnect for predictable routing delays, dedicated carry and cascade chains for arithmetic and high‑fan‑in functions, and programmable output slew‑rate control (family feature set).
Typical Applications
- Interface Bridging Implement bus adaptors, level translators and custom protocol bridges where a moderate number of I/O and configurable logic resources are required.
- Control Logic Replace discrete glue logic and small PLD arrays in system controllers, sequencers, and peripheral timing functions.
- Peripheral Integration Consolidate multiple TTL/logic functions into a single device for simplified PCB routing and reduced component count.
- High‑pin, Low‑RAM Designs Ideal for designs that need many I/O and registered logic but do not require embedded block RAM.
Unique Advantages
- Compact, Surface‑Mount Package: 100‑TQFP (14 × 14 mm) offers a space‑efficient footprint for dense board layouts while preserving access to 68 user I/O pins.
- 5 V System Compatibility: Specified 4.75 V to 5.25 V supply range aligns with common 5.0 V TTL systems, simplifying integration into legacy and existing platforms.
- Consolidation of Discrete Logic: Approximately 4,000 gates and 336 logic elements enable replacement of multiple discrete devices, reducing BOM and board complexity.
- FLEX 8000 Family Design Benefits: Family architecture features—such as FastTrack routing and dedicated carry/cascade resources—provide predictable routing and efficient implementation of arithmetic and wide‑fan‑in logic (family‑level attributes).
- Commercial Temperature Profile: 0 °C to 70 °C operating range supports typical commercial electronics and consumer applications.
- RoHS Compliance: Meets lead‑free manufacturing requirements to support modern production and environmental standards.
Why Choose EPF8452ATC100-4N?
The EPF8452ATC100-4N positions itself as a practical, moderate‑density programmable logic option for designers needing a compact, 5 V‑compatible FPGA with a substantial number of user I/O and registered logic capacity. Its 100‑pin TQFP package and surface‑mount form factor make it well suited for board designs where space and integration are priorities.
Engineers designing control logic, bus interfaces, and peripheral glue logic will find the device’s balance of logic resources and I/O convenient for consolidating discrete components and simplifying PCB routing, while the FLEX 8000 family architectural features provide a solid foundation for predictable routing and arithmetic function implementation.
Request a quote today to check availability and pricing, or submit your quote request to receive fast procurement information for the EPF8452ATC100-4N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018