EPF8452ATC100-3N

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 336 100-TQFP

Quantity 1,541 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs42Number of Logic Elements/Cells336
Number of Gates4000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8452ATC100-3N – FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 336 100-TQFP

The EPF8452ATC100-3N is a FLEX 8000 family FPGA in a 100-pin TQFP (14×14) package designed for mid-density programmable logic applications. Built on the FLEX architecture, it provides a register-rich, CMOS programmable logic fabric suitable for bus interfaces, control logic, coprocessors and similar embedded functions.

This device delivers 336 logic elements, up to 4,000 gates of usable logic, and 78 user I/O pins, with a 5 V-compatible core and I/O support for mixed 5.0 V / 3.3 V signaling. It is supplied in a surface-mount package and rated for commercial temperature operation.

Key Features

  • Logic Capacity  336 logic elements and approximately 4,000 usable gates provide compact programmable logic for mid-density designs.
  • I/O and Voltage  78 user I/O pins with MultiVolt I/O capability to support 5.0 V core operation and compatibility with 5.0-V and 3.3-V logic levels.
  • Configuration and Test  Supports in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller; the FLEX family also includes JTAG boundary-scan test (BST) circuitry on selected devices.
  • Interconnect and Arithmetic  FastTrack continuous routing structure plus dedicated carry and cascade chains to accelerate arithmetic, counters and high-fan-in logic (family-level architecture).
  • Power and Low-Power Modes  Designed for low standby current (typical standby specification noted in family documentation), and operates from a 4.75 V to 5.25 V supply range.
  • Package and Mounting  100-TQFP (14×14) surface-mount package suited for compact PCB layouts; RoHS compliant.
  • Operating Range  Commercial grade operation with an ambient temperature rating of 0 °C to 70 °C.
  • On-chip Memory  Total RAM Bits: 0 (no embedded RAM on this device variant).
  • Development Support  FLEX 8000 family devices are supported by the documented MAX+PLUS II development system and standard HDL/netlist flows (family-level tooling referenced in documentation).

Typical Applications

  • Bus Interfaces  Implement protocol glue logic and bus bridging where multiple 32-bit or narrower buses require programmable interfacing and control.
  • TTL Integration  Integrate TTL-level subsystems with programmable timing and logic consolidation using the device's 5 V I/O compatibility.
  • Coprocessor and Control Logic  Offload specialized control tasks or coprocessor functions using the device's register-rich architecture and dedicated arithmetic chains.
  • High-Speed Controllers  Build compact controller logic for peripherals and subsystems that benefit from predictable routing and dedicated cascade/carry structures.

Unique Advantages

  • Balanced mid-density resource set  336 logic elements and 78 I/O pins provide an efficient footprint for designs that need more than simple CPLDs but less than very large FPGAs.
  • 5 V system compatibility  Operates from a 4.75 V to 5.25 V supply and supports mixed 5.0 V / 3.3 V I/O levels for legacy and mixed-voltage systems.
  • Compact surface-mount packaging  100-pin TQFP (14×14) enables space-efficient PCB integration while remaining accessible for standard assembly processes.
  • Family-level toolchain and architecture  The FLEX 8000 architecture and documented development tools simplify design entry, place-and-route, and integration into existing HDL flows.
  • RoHS compliant  Conforms to RoHS requirements for lead-free assembly and regulatory considerations.
  • Commercial temperature rating  Rated for 0 °C to 70 °C environments suitable for a wide range of consumer and commercial electronic products.

Why Choose EPF8452ATC100-3N?

The EPF8452ATC100-3N positions itself as a practical mid-density FLEX 8000 FPGA option when you need a register-rich programmable device with a balanced combination of logic elements, I/O count, and 5 V system compatibility. Its 100-TQFP surface-mount package and RoHS compliance make it suitable for compact commercial electronic designs that require predictable interconnect behavior and in-circuit reconfigurability at the family level.

This device is well suited for designers consolidating glue logic, bus interfaces, or control functions who value a documented toolchain and family-level architectural features such as dedicated arithmetic chains and continuous routing.

Request a quote or submit a procurement inquiry to check availability and lead times for EPF8452ATC100-3N.

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