EPF8452AQC160-2
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 120 336 160-BQFP |
|---|---|
| Quantity | 1,301 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 160-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 160-BQFP | Number of I/O | 120 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 42 | Number of Logic Elements/Cells | 336 | ||
| Number of Gates | 4000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8452AQC160-2 – FLEX 8000 Field Programmable Gate Array (FPGA) IC, 120 I/O, 336 Logic Elements, 160‑BQFP
The EPF8452AQC160-2 is a FLEX 8000 family FPGA manufactured by Intel, offered in a 160‑pin BQFP surface‑mount package. It provides a mid-range, register‑rich programmable logic solution suited for control, interface and bus‑oriented designs that require a mix of I/O density and programmable logic resources.
Built on the FLEX 8000 architecture, the device targets applications that benefit from in‑circuit reconfigurability and a predictable routing structure, while operating from a standard 5 V supply and within a commercial temperature range.
Key Features
- Logic Resources — 336 logic elements providing a compact 4‑input LUT plus register architecture for implementing combinational and sequential logic.
- I/O and Package — 120 user I/O pins in a 160‑BQFP package; supplied in a 160‑PQFP (28×28) supplier package outline for surface‑mount assembly.
- Voltage and Power — Operates from a 4.75 V to 5.25 V supply rail, supporting conventional 5.0 V system environments.
- Temperature and Grade — Commercial grade device specified for 0 °C to 70 °C operation.
- Register‑Rich Architecture — Family‑level register emphasis (FLEX 8000 series) provides hundreds of flip‑flops to support wide‑data‑path and DSP‑style functions; the FLEX 8000 family documentation cites substantial register resources for mid‑range devices.
- Flexible Interconnect and Arithmetic Support — FLEX 8000 family features include a continuous routing structure and dedicated carry/cascade chains to simplify implementation of adders, counters and high‑fan‑in logic (family feature).
- In‑Circuit Reconfigurability — Supports reconfiguration via external configuration devices or an intelligent controller (family feature).
- System Test and I/O Control — Family documentation describes JTAG boundary‑scan support on selected devices and programmable output slew‑rate control to manage switching noise at the board level.
- Compliance — RoHS compliant surface‑mount device for lead‑free assembly processes.
Typical Applications
- Bus and Interface Bridging — Use the EPF8452AQC160-2 to implement TTL/parallel bus interfaces and glue logic for motherboard or peripheral boards where multiple 32‑bit buses or wide data paths are required.
- Embedded Controller and Glue Logic — Implement custom control state machines, protocol translators and mid‑range coprocessor control logic leveraging the device’s mixed combinational and sequential resources.
- High‑Speed I/O Aggregation — With 120 I/O pins and programmable slew control, the device is suited for consolidating multiple I/O channels and managing board‑level signal conditioning.
- Prototyping and Reconfigurable Systems — The family’s in‑circuit reconfigurability enables iterative hardware development and field updates without board rework.
Unique Advantages
- Balanced Logic and I/O Density: 336 logic elements paired with 120 I/O pins provides a practical balance for mid‑range designs needing both compute and connectivity on a single device.
- Standard 5 V Compatibility: 4.75 V to 5.25 V supply range makes integration straightforward in existing 5 V system architectures without additional power translation.
- Surface‑Mount, High‑Pin Package: The 160‑pin BQFP (supplier 160‑PQFP, 28×28) allows high I/O count in a compact, board‑level footprint for space‑constrained designs.
- Reconfigurability for Iteration: Family features supporting in‑circuit reconfiguration reduce development time and enable field updates to implement new features or fixes.
- Design Predictability: FLEX 8000 family routing and dedicated arithmetic chains simplify timing predictability for critical paths and arithmetic functions.
Why Choose EPF8452AQC160-2?
The EPF8452AQC160-2 positions itself as a mid‑range programmable logic device for projects that need a compact set of logic elements with substantial I/O. Its FLEX 8000 family architecture offers predictable routing, dedicated arithmetic support and in‑circuit reconfiguration capabilities—features that help reduce design iterations and lower system BOM compared with multi‑chip solutions.
This device is well suited to engineering teams and procurement groups designing commercial‑grade embedded controllers, bus interfaces and I/O aggregation solutions that operate from a 5 V rail and require a reliable surface‑mount package with RoHS compliance.
Request a quote or submit a purchase inquiry to check pricing and availability for EPF8452AQC160-2 and plan your next design iteration.

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