EPF8452AQC160-3

IC FPGA 120 I/O 160QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 120 336 160-BQFP

Quantity 523 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package160-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case160-BQFPNumber of I/O120Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs42Number of Logic Elements/Cells336
Number of Gates4000ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of EPF8452AQC160-3 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 120 336 160-BQFP

The EPF8452AQC160-3 is a FLEX 8000 family programmable logic device from Intel, built as a CMOS FPGA architecture that combines compact look-up-table logic with programmable registers. It is targeted at embedded and system-level designs that require flexible, reconfigurable logic with substantial I/O capacity and deterministic routing for bus interfaces, control functions, and DSP-style datapaths.

Key architectural elements include 4-input LUT-based logic elements with dedicated arithmetic and cascade chains and support for in-circuit reconfigurability and JTAG boundary-scan test. The device is offered in a 160-pin surface-mount package and supports standard 5.0 V operation.

Key Features

  • Logic Capacity — 336 logic elements organized to support a variety of combinational and registered functions, enabling mid-density programmable logic implementations.
  • Logic Array Structure — Architecture includes dedicated carry and cascade chains for efficient arithmetic and wide fan-in functions, improving synthesis mapping for adders, counters, and comparators.
  • I/O Density — Up to 120 user I/O pins, suitable for multi-bus integration and mixed-signal interface routing on a single device.
  • Package and Mounting — 160-BQFP package case with surface-mount mounting; supplier device package listed as 160-PQFP (28×28), supporting compact board-level integration.
  • Configuration and Test — In-circuit reconfigurability via external configuration devices or an intelligent controller and JTAG boundary-scan test circuitry for device-level testability (selected device support documented in family datasheet).
  • I/O Flexibility — MultiVolt I/O interface capability described in the FLEX 8000 family, enabling device core operation at 5.0 V with I/O compatibility for 5.0-V and 3.3-V logic levels.
  • Power and Operating Range — Specified supply voltage of 4.75 V to 5.25 V and commercial operating temperature range of 0 °C to 70 °C.
  • Standards and Compliance — RoHS compliant and implemented in a CMOS process for low-power standby characteristics as described for the FLEX 8000 family.
  • Design Tool Support — Family-level design support and automatic place-and-route provided by the MAX+PLUS II development system and common EDA interfaces referenced for FLEX 8000 devices in the datasheet.

Typical Applications

  • Digital Signal Processing (DSP) — Provides a large register count and dedicated arithmetic chains for datapath manipulation, filtering, and transformation tasks.
  • Bus Interfaces and Bridge Logic — High I/O count and predictable routing make the device suitable for implementing bus controllers and multi-bus integration on a single IC.
  • High-Speed Control and Coprocessing — Dedicated carry/cascade resources and abundant registers support high-performance control logic and coprocessor functions.
  • TTL Integration and Glue Logic — Flexible I/O and LUT-based logic elements enable seamless TTL-level interfacing and system glue functions.

Unique Advantages

  • Balanced Mid-Density Logic: 336 logic elements provide a practical balance between gate count and design complexity for mid-range programmable designs.
  • High I/O Count in a Compact Package: 120 user I/Os in a 160-pin surface-mount package reduce board-level routing complexity for multi-bus and multi-sensor systems.
  • Deterministic Routing: Family routing architecture and dedicated chains deliver predictable timing for arithmetic and wide fan-in functions, simplifying timing closure.
  • Reconfigurability and Testability: In-circuit reconfigurability and JTAG boundary-scan support streamline development, field updates, and manufacturing test flows.
  • Straightforward Power Requirements: Operates from a standard 5.0 V supply (4.75 V–5.25 V), simplifying power distribution in legacy 5-V systems.
  • Established Toolchain Support: Documented support for MAX+PLUS II and common EDA interfaces helps accelerate design entry, simulation, and place-and-route.

Why Choose EPF8452AQC160-3?

The EPF8452AQC160-3 offers a practical, mid-density FLEX 8000 FPGA option for embedded and system designers who need flexible logic, sizable I/O, and deterministic routing in a 160-pin surface-mount package. Its combination of 336 logic elements, dedicated arithmetic resources, and reconfiguration/test features addresses a broad set of bus, control, and DSP-style tasks while fitting within standard 5-V system architectures.

Supported by the FLEX 8000 family design tools and documented configuration/test capabilities, this device is appropriate for teams looking to integrate multiple data paths, implement coprocessor or controller logic, and maintain field reconfigurability with established development flows.

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