LAV-AT-X30-1LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 1,005 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-X30-1LFG676I – Avant™-X Field Programmable Gate Array (FPGA), 262,000 logic elements

The LAV-AT-X30-1LFG676I is an Avant™-X FPGA device that combines a high logic element count with substantial on-chip memory and dense I/O in a compact FCBGA package. Built on the Lattice Avant platform architecture, the device exposes programmable compute fabric, on‑chip sysMEM and sysDSP resources, and advanced clocking and I/O capabilities described in the Avant platform datasheet.

This industrial‑grade, surface‑mount FPGA is aimed at applications that require programmable logic, multi‑bank I/O, and robust temperature operation. Key value comes from its integration of programmable logic (262,000 logic elements), approximately 1.74 Mbits of embedded memory, and 298 I/O pins in a 676‑FCBGA (27×27) package.

Key Features

  • Logic Capacity — 262,000 logic elements for implementing complex programmable logic, control, and data-path functions.
  • Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM (total RAM bits: 1,740,800) supporting sysMEM modes including single/dual/pseudo‑dual port and FIFO configurations as outlined in the Avant platform.
  • I/O Density — 298 general‑purpose I/O pins providing broad external interfacing and multi‑bank sysI/O support.
  • Package and Mounting — 676‑FCBGA package (27×27 mm) supplied in a surface‑mount form factor for compact board placement.
  • Core Voltage — Core supply specified at 820 mV (0.82 V), matching the Avant platform's low‑voltage core requirements.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial environments.
  • Platform Architecture Features — Includes Avant platform building blocks such as programmable functional units (PFU) and slices, flexible routing, and clocking resources (on‑chip oscillator, PLL, global/regional/edge clocks, dynamic clock control).
  • Memory and DSP Support — sysMEM features (bus size matching, memory cascading, initialization/ROM operation) and sysDSP blocks for data processing as described in the Avant datasheet.
  • High‑Speed Interfaces and PHY Support — Device architecture includes SERDES/PMA, multi‑protocol PCS, and DDRPHY support for DDR memory interfaces as documented in the platform overview.
  • Configuration and Reliability — Enhanced configuration options, JTAG support, SEU handling, and trace ID capabilities are part of the device configuration features in the Avant platform documentation.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Automation — Use the industrial temperature rating, high I/O count, and programmable logic to implement motor control, sensor aggregation, and protocol bridging for factory equipment.
  • Communications and Networking — Leverage SERDES/PCS blocks, DDRPHY support, and abundant logic and memory for protocol processing, packet handling, or interface aggregation.
  • Embedded Compute and Acceleration — Deploy sysDSP and on‑chip memory together with large logic capacity to offload deterministic data‑path tasks and custom accelerators.
  • Instrumentation and Test Equipment — Combine dense I/O and flexible clocking resources for data acquisition, timing, and real‑time processing in test and measurement systems.

Unique Advantages

  • High Logic and Memory Integration: 262,000 logic elements and approximately 1.74 Mbits of embedded RAM reduce external component needs and simplify board-level design.
  • Dense I/O in a Compact Package: 298 I/O pins in a 676‑FCBGA (27×27) surface‑mount package enable high connector and sensor counts while conserving board area.
  • Advanced Clocking and PHY Support: On‑chip oscillator, PLLs, multiple global/regional clocks, and SERDES/DDRPHY capabilities support precise timing and high‑speed interface integration.
  • Industrial Robustness: Rated for −40 °C to 100 °C and RoHS compliant, making the device suitable for industrial deployments requiring extended temperature operation.
  • Platform Feature Set: The Avant platform provides modular building blocks (sysMEM, sysDSP, programmable I/O cells, configuration/JTAG options) for predictable integration and system reproducibility.

Why Choose LAV-AT-X30-1LFG676I?

The LAV-AT-X30-1LFG676I positions itself as a highly integrated Avant™-X FPGA option for designs that demand a balance of logic capacity, embedded memory, and dense I/O in a compact industrial package. Its platform‑level features—programmable functional units, advanced clocking, memory modes, and PHY support—allow engineers to consolidate functions that would otherwise require multiple components.

This FPGA is well suited for teams developing industrial automation, communications, embedded compute, or instrumentation solutions that require deterministic programmable logic, substantial on‑chip memory, and robust thermal performance. The device’s platform documentation provides detailed architectural information to assist in system design and integration.

Request a quote or submit a purchase inquiry to get pricing and availability for LAV-AT-X30-1LFG676I. Our team can provide lead‑time information and help you evaluate the device for your next design.

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