LAV-AT-X30-2ASG410C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP |
|---|---|
| Quantity | 1,057 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 410-WLCSP (11x9) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 410-BGA, WLCSP | Number of I/O | 196 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-X30-2ASG410C – Avant™-X FPGA, 262k Logic Elements, ~1.74 Mbit RAM, 196 I/O, 410‑WLCSP
The LAV-AT-X30-2ASG410C is a field-programmable gate array (FPGA) device from the Lattice Avant platform. It combines a high count of programmable logic elements with embedded memory and flexible I/O to support custom digital logic, system integration, and memory‑attached interfaces.
Designed for commercial‑grade deployments, this Avant‑X device provides 262,000 logic elements, approximately 1.74 Mbits of on‑chip RAM, and 196 user I/O in a 410‑WLCSP (11×9) package. Key on‑chip subsystems described in the Avant platform datasheet include programmable functional units, clock management, sysMEM and sysDSP blocks, programmable I/O cells, DDRPHY support, SERDES/PCS, and device configuration facilities.
Key Features
- Core Logic — 262,000 logic elements for implementing custom combinational and sequential logic structures across the Avant architecture.
- Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM with support for single, dual and pseudo‑dual port modes, FIFO operation, and memory cascading as described in the Avant sysMEM section.
- I/O Density & Flexibility — 196 user I/O pins with a programmable I/O cell architecture and support for multiple I/O standards and banking schemes.
- Clocking & Timing — Integrated clocking features from the Avant platform including on‑chip oscillator, PLLs, global and regional clocks, edge clocks, dynamic clock select/control, and DLL delay options for flexible clock distribution.
- High‑Speed Interfaces — Platform support for SERDES/PMA blocks, Multi‑Protocol PCS and MPPHY integration, and DDR memory support via DDRPHY and DQS grouping (platform capability described in the datasheet).
- DSP & Acceleration — sysDSP elements are included in the Avant architecture to support arithmetic and signal processing kernels in hardware.
- Device Configuration & Debug — Configuration options include JTAG and SEU handling mechanisms referenced in the Avant platform overview.
- Package & Mounting — 410‑WLCSP (11×9) supplier device package; surface‑mount mounting type suitable for compact board footprints.
- Electrical & Environmental — Voltage supply specified at 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Prototyping and Custom Logic — Implement and iterate custom digital logic, hardware accelerators, and system prototypes using the device’s programmable logic and abundant on‑chip memory.
- Interface Bridging and Aggregation — Consolidate multiple peripherals and protocol endpoints using the flexible I/O, programmable I/O cells, and SERDES/PHY capabilities described in the platform overview.
- Embedded Signal Processing — Leverage sysDSP and local memory to offload compute‑intensive signal processing tasks from the host processor.
- Memory‑Attached Designs — Integrate DDR memory interfaces and use DDRPHY support for designs requiring external memory access and DQS grouping.
Unique Advantages
- Substantial Logic Capacity: 262,000 logic elements enable complex designs and multi‑function integration on a single device.
- Integrated On‑Chip Memory: Approximately 1.74 Mbits of embedded RAM reduce external memory dependence for many control and buffering tasks.
- Flexible Clocking & Timing: Extensive clocking options (PLL, on‑chip oscillator, global/regional clocks, dynamic controls) support diverse timing and performance requirements.
- Compact, High‑Density Packaging: 410‑WLCSP (11×9) package and surface‑mount mounting support small form‑factor board designs.
- Platform Feature Set: Avant platform building blocks—sysMEM, sysDSP, DDRPHY, SERDES/PCS, and device configuration facilities—enable a broad range of system‑level capabilities as described in the datasheet.
- Commercial Temperature Range: Rated for 0 °C to 85 °C for typical commercial applications.
Why Choose LAV-AT-X30-2ASG410C?
The LAV-AT-X30-2ASG410C brings the Lattice Avant platform’s architecture into a compact, surface‑mount package with a balance of logic capacity, embedded memory, and flexible I/O. Its platform features for clocking, memory, DSP, and high‑speed interfaces make it suitable for developers who need programmable hardware building blocks for prototyping, interface consolidation, and on‑device acceleration.
For teams focused on commercial‑grade embedded designs that require a programmable, integrated solution with documented platform capabilities, this Avant‑X device offers a clear set of verifiable resources—logic elements, memory, I/O count, packaging, and configuration features—backed by the Avant platform overview in the datasheet.
Request a quote or submit a product inquiry to receive pricing and availability information for the LAV-AT-X30-2ASG410C.