LAV-AT-X30-2ASG410I

The LAV-AT-X30-2ASG410I is an Avant™-X series FPGA device from Lattice Semiconductor offered in a 410-ball WLCSP package. It integrates 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 196 user I/O to address dense programmable-logic requirements in industrial applications.

Built on the Lattice Avant platform, the device provides on-chip clocking resources, programmable I/O and memory subsystems, and platform-level support for SERDES, PHY, and DDR interfaces as described in the Avant platform documentation. The device is supplied in a compact 410-WLCSP (11×9) package and is specified for industrial temperature operation.

Key Features

• Core Logic — 262,000 logic elements provide substantial programmable capacity for control, signal processing, and interface logic implementation.
• Embedded Memory — Approximately 1.74 Mbits of on-chip RAM for data buffering, FIFOs, and embedded storage.
• I/O Capability — 196 user I/O pins support a wide range of external interfaces and signaling requirements.
• Clocking and Timing — Avant platform features such as an on-chip oscillator, PLLs, global and regional clocking resources, dynamic clock control, and DLL delay elements support flexible clock architecture.
• Memory and DSP Support — Platform-level sysMEM blocks, sysDSP resources, and DDRPHY support are included in the Avant platform overview for memory-intensive and signal-processing applications.
• Programmable I/O Cells (PIC) — Dedicated PIC structures with input/output/tri-state register blocks and support for multiple I/O standards are part of the platform architecture.
• SERDES and PCS — Platform documentation lists SERDES/PMA blocks and multi-protocol PCS/PHY integration for high-speed serial interfaces.
• Package & Mounting — 410-BGA WLCSP (supplier device package: 410-WLCSP 11×9) intended for surface-mount assembly.
• Industrial Grade & Temperature — Specified operating temperature range of -40 °C to 100 °C and industrial grade designation.
• Supply Voltage — Device supply specified at 820 mV.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic, motor control interfaces, and deterministic I/O aggregation within industrial temperature environments.
• Communications & Networking — Use platform SERDES, PCS, and programmable I/O to implement protocol handling, packet processing, and high-speed link interfaces.
• Memory Interface and Buffering — Leverage sysMEM and DDRPHY support for on-device buffering, FIFO management, and memory-mapped data paths.
• Signal Processing — Combine sysDSP resources with on-chip RAM to build custom DSP pipelines and acceleration blocks.

Unique Advantages

• Substantial Logic Capacity: 262,000 logic elements enable implementation of complex combinational and sequential logic without external CPLDs.
• Integrated On-Chip Memory: Approximately 1.74 Mbits of embedded RAM reduces external memory dependencies for many buffer and FIFO use cases.
• Comprehensive Clocking Resources: On-chip oscillator, PLLs, and regional/global clock structures provide flexible timing architectures for mixed clock domains.
• Compact, Surface-Mount Packaging: 410-WLCSP (11×9) package minimizes board area for space-constrained designs while supporting surface-mount assembly.
• Industrial Temperature Range: Rated for -40 °C to 100 °C to meet the thermal requirements of industrial applications.
• Platform-Level Peripheral Support: Documented platform features including DDRPHY, SERDES/PCS and programmable I/O cells simplify integration of memory and high-speed interfaces.

Why Choose LAV-AT-X30-2ASG410I?

The LAV-AT-X30-2ASG410I positions itself as a versatile Avant™-X FPGA offering a balance of logic capacity, embedded memory, and I/O density in a compact WLCSP package. Its documented platform features—clocking blocks, sysMEM, sysDSP, DDR support, and SERDES/PCS integration—help designers consolidate functions onto a single programmable device for reduced system complexity.

This device is suited for engineers designing industrial-grade embedded systems, communications modules, and memory- or DSP-focused subsystems that require broad on-chip resources and a compact package footprint. RoHS compliance and the specified industrial temperature range support deployment in regulated and temperature-stressed environments.

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