LAV-AT-X30-2LFG676I

The LAV-AT-X30-2LFG676I is an Avant™-X FPGA IC from Lattice Semiconductor designed as a programmable logic platform with a dense complement of logic, memory and I/O resources. The device integrates approximately 262,000 logic element cells, about 1.74 Mbits of on-chip RAM, and 298 I/O pins in a 676‑FCBGA (27×27) surface-mount package.

Architected for systems that require flexible programmable logic, on-chip memory and multiple clocking and interface options, the device targets industrial applications that benefit from wide temperature operation (−40 °C to 100 °C) and RoHS-compliant construction.

Key Features

• Core Logic — 262,000 logic element cells provide a large programmable fabric for implementing custom logic, state machines, and datapath functions.
• Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (sysMEM) supporting single, dual and pseudo-dual port modes, FIFO operation and memory cascading options described in the platform documentation.
• I/O Capacity — 298 programmable I/O pins with a banking scheme and programmable I/O cell (PIC) features for flexible interface implementations.
• Clocking and Timing — On-chip oscillator and PLL, with support for global, regional and edge clocks plus dynamic clock control, synchronizers and dividers for complex timing architectures.
• High-speed Interfaces — Platform includes SERDES/PMA blocks, Multi‑Protocol PCS (MPPCS) and DDRPHY support for DDR memory interfaces and serial link integration.
• Programmable DSP and Functional Units — Architecture includes programmable functional unit (PFU) blocks and sysDSP resources for signal-processing and arithmetic workloads.
• Device Configuration and Reliability — Enhanced configuration options, JTAG support and Single Event Upset (SEU) handling capabilities are included in the platform overview.
• Package and Environmental — 676‑BBGA (676‑FCBGA, 27×27) surface-mount package, industrial grade with operating range −40 °C to 100 °C and RoHS compliant.
• Supply Voltage — Specified supply point at 820 mV as documented for the device.

Typical Applications

• High‑performance memory interfaces — Implement DDR controllers and PHYs using the device's DDRPHY features and DQS grouping support.
• High‑speed serial communications — Integrate SERDES/PMA and Multi‑Protocol PCS blocks to build serial link endpoints and protocol bridges.
• Industrial control and automation — Use the industrial temperature range and extensive I/O to implement motor control, sensor interfacing and machine‑control logic.
• Signal processing and acceleration — Leverage PFU blocks and sysDSP resources for real‑time data processing, protocol offload and custom accelerators.

Unique Advantages

• High logic and memory density: 262,000 logic element cells and approximately 1.74 Mbits of embedded memory enable substantial on-chip integration to reduce external components.
• Extensive I/O and package: 298 I/Os in a 676‑FCBGA (27×27) package provide ample connectivity for complex board-level interfaces while supporting a surface-mount assembly flow.
• Comprehensive clocking infrastructure: On-chip oscillator, PLLs and multiple clock domains (global, regional, edge) give designers granular control over timing and low-latency clock distribution.
• Built for high‑speed interfaces: Integrated SERDES/PMA, MPPCS and DDRPHY functionality streamline implementation of serial links and memory subsystems.
• Industrial-ready thermal range: Rated for operation from −40 °C to 100 °C, supporting deployment in demanding environments.
• Platform-level configurability and reliability: Enhanced configuration options, JTAG and SEU handling support robust device configuration and operational continuity.

Why Choose LAV-AT-X30-2LFG676I?

The LAV-AT-X30-2LFG676I pairs a large programmable fabric with embedded memory, extensive I/O and platform-level features for clocking, high-speed serial and DDR memory support. It is positioned for engineers who need a flexible, industrial-grade FPGA that consolidates logic, memory and interface functionality in a compact 676‑FCBGA package.

This device is well suited to designs requiring scalable programmable logic, sophisticated timing architectures and broad I/O connectivity. Its combination of on‑chip resources and platform features supports consolidation of board-level functions and enables more integrated system designs.

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