LAV-AT-X30-3ASG410C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP

Quantity 357 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeCommercialOperating Temperature0°C – 85°C
Package / Case410-BGA, WLCSPNumber of I/O196Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-X30-3ASG410C – Avant™-X FPGA, 262,000 Logic Elements, 410-WLCSP

The LAV-AT-X30-3ASG410C is an Avant™-X Field Programmable Gate Array (FPGA) IC designed for commercial embedded systems. Based on the Lattice Avant platform architecture, this device provides a programmable fabric with a large logic capacity, on-chip memory, and flexible I/O for applications that require custom digital logic, memory interfacing, and programmable I/O integration.

Key value comes from its combination of 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 196 I/O pins in a compact 410-ball WLCSP package, enabling dense integration in space-constrained designs while maintaining a broad feature set from the Avant architecture.

Key Features

  • Logic Capacity — 262,000 logic elements provide substantial programmable logic resources for implementing complex custom logic and accelerators.
  • Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (sysMEM) supporting single, dual and pseudo-dual port modes, cascading, FIFO modes, and ROM/initialization options.
  • Programmable I/O — 196 user I/O pins with a programmable I/O cell (PIC) and support for multiple sysI/O standards and banking schemes.
  • Clocking and Timing — Comprehensive clocking architecture including on-chip oscillator, PLL, global and regional clocks, edge clocks, PHYCLK and dynamic clock control features.
  • DSP and SERDES Support — Architecture includes sysDSP resources and SERDES/PCS blocks to support signal processing and high-speed serial protocols as described in the Avant platform documentation.
  • DDR Memory Support — Dedicated DDRPHY functionality and DQS grouping support for DDR memory interfaces.
  • Device Configuration and Reliability — Enhanced configuration options with JTAG support and Single Event Upset (SEU) handling features described in the Avant platform overview.
  • Package and Mounting — Surface-mount 410-WLCSP (11×9) supplier device package; package case listed as 410-BGA, WLCSP for board-level integration in compact designs.
  • Power and Temperature — Specified supply voltage of 820 mV and commercial operating temperature range of 0 °C to 85 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-density custom logic — Implement application-specific datapaths, state machines, and protocol engines using the device’s 262,000 logic elements and flexible routing.
  • Memory interface controllers — Use sysMEM and DDRPHY support for building on-chip memory structures, FIFOs, and external DDR interfaces.
  • Signal processing — Leverage sysDSP resources for embedded digital signal processing tasks within communications and sensor processing systems.
  • High-speed serial connectivity — Employ SERDES and PCS blocks for multi-protocol serial links and bridging between interfaces.

Unique Advantages

  • Substantial programmable fabric: 262,000 logic elements enable complex designs and integration of multiple functions on a single device.
  • Built-in memory flexibility: Approximately 1.74 Mbits of embedded RAM with multiple operating modes (single/dual/pseudo-dual port, FIFO, cascading) simplifies buffer and memory architecture design.
  • Comprehensive clocking: On-chip oscillator, PLLs, global and regional clocks, and dynamic clock controls provide versatile timing options for multi-domain designs.
  • Compact packaging for space-constrained boards: 410-WLCSP (11×9) surface-mount package allows high-density placement while preserving a large I/O count.
  • Designed for system-level integration: Dedicated DDRPHY, sysDSP, and SERDES/PCS capabilities support memory interfaces, signal processing, and high-speed links without external ASICs.
  • Commercial-grade deployment: RoHS-compliant and specified for 0 °C to 85 °C operation to meet typical commercial embedded system requirements.

Why Choose LAV-AT-X30-3ASG410C?

The LAV-AT-X30-3ASG410C combines a large programmable fabric with flexible memory and I/O resources drawn from the Avant™ platform architecture. Its mix of 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 196 I/Os in a compact WLCSP footprint make it suitable for designs that require substantial on-chip logic density and versatile interfacing in a commercial temperature range.

This device is well suited to engineering teams building integrated digital systems that need programmable DSP, DDR memory interfaces, and high-speed serial capabilities while maintaining a small PCB area and RoHS compliance. The Avant platform features described in the datasheet—programmable functional units, advanced clocking, sysMEM flexibility, SERDES/PCS blocks, and configuration options—provide design choices that scale as system requirements evolve.

Request a quote or submit an inquiry to purchase the LAV-AT-X30-3ASG410C for your next FPGA-based design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up