LAV-AT-X30-3ASG410C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP |
|---|---|
| Quantity | 357 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 410-WLCSP (11x9) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 410-BGA, WLCSP | Number of I/O | 196 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-X30-3ASG410C – Avant™-X FPGA, 262,000 Logic Elements, 410-WLCSP
The LAV-AT-X30-3ASG410C is an Avant™-X Field Programmable Gate Array (FPGA) IC designed for commercial embedded systems. Based on the Lattice Avant platform architecture, this device provides a programmable fabric with a large logic capacity, on-chip memory, and flexible I/O for applications that require custom digital logic, memory interfacing, and programmable I/O integration.
Key value comes from its combination of 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 196 I/O pins in a compact 410-ball WLCSP package, enabling dense integration in space-constrained designs while maintaining a broad feature set from the Avant architecture.
Key Features
- Logic Capacity — 262,000 logic elements provide substantial programmable logic resources for implementing complex custom logic and accelerators.
- Embedded Memory — Approximately 1.74 Mbits of on-chip RAM (sysMEM) supporting single, dual and pseudo-dual port modes, cascading, FIFO modes, and ROM/initialization options.
- Programmable I/O — 196 user I/O pins with a programmable I/O cell (PIC) and support for multiple sysI/O standards and banking schemes.
- Clocking and Timing — Comprehensive clocking architecture including on-chip oscillator, PLL, global and regional clocks, edge clocks, PHYCLK and dynamic clock control features.
- DSP and SERDES Support — Architecture includes sysDSP resources and SERDES/PCS blocks to support signal processing and high-speed serial protocols as described in the Avant platform documentation.
- DDR Memory Support — Dedicated DDRPHY functionality and DQS grouping support for DDR memory interfaces.
- Device Configuration and Reliability — Enhanced configuration options with JTAG support and Single Event Upset (SEU) handling features described in the Avant platform overview.
- Package and Mounting — Surface-mount 410-WLCSP (11×9) supplier device package; package case listed as 410-BGA, WLCSP for board-level integration in compact designs.
- Power and Temperature — Specified supply voltage of 820 mV and commercial operating temperature range of 0 °C to 85 °C.
- Regulatory — RoHS compliant.
Typical Applications
- High-density custom logic — Implement application-specific datapaths, state machines, and protocol engines using the device’s 262,000 logic elements and flexible routing.
- Memory interface controllers — Use sysMEM and DDRPHY support for building on-chip memory structures, FIFOs, and external DDR interfaces.
- Signal processing — Leverage sysDSP resources for embedded digital signal processing tasks within communications and sensor processing systems.
- High-speed serial connectivity — Employ SERDES and PCS blocks for multi-protocol serial links and bridging between interfaces.
Unique Advantages
- Substantial programmable fabric: 262,000 logic elements enable complex designs and integration of multiple functions on a single device.
- Built-in memory flexibility: Approximately 1.74 Mbits of embedded RAM with multiple operating modes (single/dual/pseudo-dual port, FIFO, cascading) simplifies buffer and memory architecture design.
- Comprehensive clocking: On-chip oscillator, PLLs, global and regional clocks, and dynamic clock controls provide versatile timing options for multi-domain designs.
- Compact packaging for space-constrained boards: 410-WLCSP (11×9) surface-mount package allows high-density placement while preserving a large I/O count.
- Designed for system-level integration: Dedicated DDRPHY, sysDSP, and SERDES/PCS capabilities support memory interfaces, signal processing, and high-speed links without external ASICs.
- Commercial-grade deployment: RoHS-compliant and specified for 0 °C to 85 °C operation to meet typical commercial embedded system requirements.
Why Choose LAV-AT-X30-3ASG410C?
The LAV-AT-X30-3ASG410C combines a large programmable fabric with flexible memory and I/O resources drawn from the Avant™ platform architecture. Its mix of 262,000 logic elements, approximately 1.74 Mbits of embedded memory, and 196 I/Os in a compact WLCSP footprint make it suitable for designs that require substantial on-chip logic density and versatile interfacing in a commercial temperature range.
This device is well suited to engineering teams building integrated digital systems that need programmable DSP, DDR memory interfaces, and high-speed serial capabilities while maintaining a small PCB area and RoHS compliance. The Avant platform features described in the datasheet—programmable functional units, advanced clocking, sysMEM flexibility, SERDES/PCS blocks, and configuration options—provide design choices that scale as system requirements evolve.
Request a quote or submit an inquiry to purchase the LAV-AT-X30-3ASG410C for your next FPGA-based design.

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