LAV-AT-X30-3LFG676C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA |
|---|---|
| Quantity | 251 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-X30-3LFG676C – Avant™-X Field Programmable Gate Array (FPGA) IC, 676-FCBGA (27×27)
The LAV-AT-X30-3LFG676C is an Avant™-X series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation built on the Lattice Avant platform architecture. The device combines a large programmable fabric with embedded memory and a comprehensive I/O complement for designs that require significant on-chip logic, memory, and I/O integration.
This commercial-grade, surface-mount FPGA offers approximately 262,000 logic elements, roughly 1.74 Mbits of embedded memory, and 298 I/O pins in a 676-FCBGA (27×27) package. It operates at a supply point of 820 mV and across an operating temperature range of 0 °C to 85 °C, with RoHS compliance.
Key Features
- Programmable Fabric Approximately 262,000 logic elements for implementing complex, custom digital functions within a single device.
- Embedded Memory Approximately 1.74 Mbits of total on-chip RAM bits, with architecture-level support for memory modes and cascading as described in the Avant platform documentation.
- I/O Capacity 298 user I/O pins to support wide external interfacing and system-level connectivity.
- Clocking and Timing Avant platform clocking structure including on-chip oscillator, PLL, global and regional clocks, and dynamic clock control features described in the platform overview.
- Memory and DSP Support Platform-level sysMEM and sysDSP blocks are included in the Avant architecture, supporting FIFO modes, single/dual/pseudo-dual port operation, and DSP functionality.
- High-speed Interfaces Architecture-level support for SERDES and PCS blocks and DDR memory PHY capabilities as part of the Avant platform feature set.
- Package and Mounting Supplied in a 676-FCBGA (27×27) package, intended for surface-mount PCB assembly.
- Power and Thermal Specified voltage supply listed at 820 mV and an operating temperature range of 0 °C to 85 °C (commercial grade).
- Regulatory RoHS compliant.
Typical Applications
- Memory-Intensive Systems Designs requiring on-chip RAM with support for FIFO and various memory-port modes can leverage the device's embedded memory and sysMEM architecture.
- High-Speed Serial Interfaces Systems that utilize SERDES/PCS and DDR PHY features in the Avant platform for high-speed link implementation.
- Custom Logic and Acceleration Applications that need substantial programmable logic capacity for offloading or accelerating domain-specific functions.
Unique Advantages
- Large Programmable Capacity: Approximately 262,000 logic elements provide a broad fabric for consolidating multiple functions on-chip, reducing external component count.
- Integrated On-Chip Memory: Approximately 1.74 Mbits of embedded RAM supports tight data paths and memory-intensive designs without immediate reliance on external memory.
- Extensive I/O: 298 I/O pins enable flexible interfacing options for complex systems and rich peripheral connectivity.
- Platform-Level Subsystems: The Avant architecture includes clocking, sysMEM, sysDSP, DDR PHY, and SERDES/PCS building blocks to simplify implementation of common FPGA subsystems.
- Compact Ball Grid Package: 676-FCBGA (27×27) package provides a high pin-count solution in a compact footprint for space-constrained PCBs.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose LAV-AT-X30-3LFG676C?
The LAV-AT-X30-3LFG676C is positioned for commercial designs that need significant programmable logic capacity, embedded memory, and a large I/O complement in a compact BGA package. The Avant platform’s documented subsystems—covering clocking, memory modes, DSP support, DDR PHY, and SERDES/PCS—provide a structured architecture for implementing complex system functions.
This device is suited to engineers and procurement teams looking for a high-capacity FPGA solution with platform-level features and a defined commercial operating range. Its combination of logic resources, on-chip memory, and I/O density supports consolidation of multiple functions and helps manage BOM and board-level complexity.
Request a quote or submit an inquiry to obtain pricing and availability for LAV-AT-X30-3LFG676C. Our team can provide order and lead-time information to assist your design planning.

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