LAV-AT-X30-3LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 521 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-X30-3LFG676I – Avant™-X Field Programmable Gate Array (FPGA), 676-FCBGA

The LAV-AT-X30-3LFG676I is an Avant™-X platform Field Programmable Gate Array (FPGA) offered in a 676-FCBGA (27×27) package. It provides a programmable fabric with 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 298 I/O pins for complex interfacing in industrial-grade applications.

Designed around the Lattice Avant architecture, this device includes platform-level features such as advanced clocking, sysMEM and sysDSP blocks, DDR PHY support, SERDES/PCS capabilities, and configuration options referenced in the Avant platform documentation. The device is RoHS compliant and rated for surface-mount assembly and industrial operating temperatures.

Key Features

  • Logic Capacity: 262,000 logic elements available for implementing custom digital functions and complex design partitions.
  • Embedded Memory: Approximately 1.74 Mbits of on-chip RAM with sysMEM features including single/dual/pseudo-dual port modes, FIFO modes, memory cascading, and RAM initialization/ROM operation.
  • I/O and Interfaces: 298 I/O pins and a programmable I/O (PIO) architecture; platform documentation includes supported sysI/O standards, banking, and programmable I/O cell functionality.
  • Clocking and Timing: Advanced clocking infrastructure described in the platform, including on-chip oscillator, PLL, global and regional clocks, dynamic clock control, and clock synchronizers/dividers.
  • High-Speed and PHY Support: Avant platform-level references to DDRPHY for DDR memory support, SERDES/PMA blocks, and Multi-Protocol PCS/PHY integration for high-speed connectivity.
  • Device Configuration and Reliability: Platform-level configuration options include enhanced configuration methods, JTAG support, and Single Event Upset (SEU) handling mechanisms as documented for the Avant family.
  • Package and Assembly: 676-BBGA / 676-FCBGA (27×27) package, surface-mount mounting type suitable for standard PCB assembly processes.
  • Voltage and Temperature: Voltage supply documented as 820 mV; industrial operating temperature range of −40 °C to 100 °C.
  • Compliance: RoHS compliant.

Typical Applications

  • Custom digital logic and prototyping: Use the Avant™-X fabric and 262,000 logic elements to implement bespoke datapaths, control logic, and prototyping tasks.
  • Memory-centric embedded processing: Approximately 1.74 Mbits of embedded RAM and sysMEM capabilities enable local buffering, FIFO implementations, and embedded storage for accelerators and controllers.
  • High-pin-count I/O systems: 298 I/O pins support complex peripheral interfacing, multi-bank I/O schemes, and integration with external memory through DDRPHY support.

Unique Advantages

  • Substantial programmable capacity: 262,000 logic elements provide the headroom to map large custom IP blocks and parallel processing elements.
  • Integrated memory features: Approximately 1.74 Mbits of embedded RAM plus sysMEM modes reduce external memory dependencies for many buffering and storage tasks.
  • Comprehensive platform-level features: Avant platform documentation describes clocking, PLLs, DDRPHY, SERDES/PCS, and sysDSP blocks—enabling system designers to leverage a broad set of integrated capabilities.
  • Industrial readiness: Rated for −40 °C to 100 °C operation and supplied in a 676-FCBGA surface-mount package for deployment in industrial systems.
  • Wide I/O flexibility: 298 I/O pins and programmable I/O cell features support diverse signaling standards and banking strategies described in the platform materials.
  • Regulatory and assembly considerations: RoHS compliance and standard surface-mount packaging simplify manufacturing and environmental regulatory alignment.

Why Choose LAV-AT-X30-3LFG676I?

The LAV-AT-X30-3LFG676I places a sizable programmable fabric and embedded memory into a 676-FCBGA footprint, delivering a combination of logic capacity, on-chip RAM, and high I/O count suitable for complex industrial designs. Its platform-level features—clocking infrastructure, DDRPHY and SERDES/PCS references, sysMEM and sysDSP blocks, and configuration options—provide the building blocks needed for configurable data-paths, memory interfaces, and high-speed links as documented for the Avant family.

This device is a fit for engineering teams seeking a platform-based FPGA solution with industrial temperature range, substantial logic and memory resources, and comprehensive platform documentation to support integration and long-term maintainability.

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