LAV-AT-X30-3LBG484I

The LAV-AT-X30-3LBG484I is an Avant™-X Field Programmable Gate Array (FPGA) provided in a 484-FCBGA (19×19) package with surface-mount mounting. This industrial-grade device integrates 262,000 logic elements and 1,740,800 bits of on-chip RAM (approximately 1.74 Mbits), plus 218 user I/O pins, making it suitable for high-density, configurable logic implementations that require significant I/O and embedded memory.

Architected as part of the Lattice Avant platform, the device supports platform-level features documented in the series datasheet such as programmable I/O termination, on-chip PLLs and oscillators, ESD performance characteristics, and hardened PCIe capabilities described for the Avant family.

Key Features

• Core Density  262,000 logic elements for large, complex logic designs and multi-function implementations.
• Embedded Memory  1,740,800 bits of total RAM (approximately 1.74 Mbits) to support buffering, state machines, and data storage on-chip.
• I/O Capacity & Standards  218 user I/Os; the Avant platform documentation details support for multiple sysI/O standards and high-speed interfaces used across the family.
• Power Supply  Specified voltage supply listed as 820 mV (820 mV to 820 mV), enabling low-voltage operation as defined in the product specifications.
• Package & Mounting  484-BFBGA / 484-FCBGA (19×19) package in a surface-mount form factor for compact board integration.
• Operating Temperature  Industrial temperature range: −40 °C to 100 °C, suitable for demanding thermal environments.
• Platform-Level Reliability & IO Management  Series-level datasheet includes features such as on-chip programmable termination, ESD performance specifications, power-supply sequencing guidance, PLLs and internal oscillators, and hardened PCIe characteristics for the Avant platform.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Deploy the device where extensive combinational and sequential logic is required, leveraging 262,000 logic elements and embedded RAM.
• I/O-intensive systems  Use the 218 I/Os to interface with multiple sensors, peripherals, or parallel interfaces in compact systems.
• Platform-based designs  Integrate into designs that benefit from Avant platform capabilities such as on-chip termination, PLLs, and documented high-speed interface support.

Unique Advantages

• High integration density: 262,000 logic elements and on-chip RAM reduce the need for external logic and memory, simplifying board-level BOM.
• Robust I/O count: 218 user I/Os provide flexibility to route signals to many peripherals without multiplexing compromises.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in thermally demanding environments.
• Compact BGA package: 484-FCBGA (19×19) packaging supports dense PCB implementations while preserving signal integrity in multi-layer designs.
• Platform-level features documented: Avant family documentation includes details on programmable termination, ESD, PLLs, internal oscillators, and hardened PCIe characteristics for designers referencing system-level capabilities.
• Regulatory compliance: RoHS compliant for environmental and manufacturing considerations.

Why Choose LAV-AT-X30-3LBG484I?

The LAV-AT-X30-3LBG484I positions itself as an industrial-grade, high-density FPGA option within the Avant platform family. Its combination of 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 218 user I/Os provides a strong balance of logic capacity, memory, and connectivity for designs that require substantial on-chip resources and a broad I/O complement.

Designed for engineers and procurement teams targeting scalable, platform-based FPGA solutions, this device delivers clear, documented specifications—package, supply voltage, and thermal range—that help streamline system integration and long-term deployment planning.

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