LAV-AT-X30-3ASG410I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 196 1740800 262000 410-BGA, WLCSP

Quantity 648 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package410-WLCSP (11x9)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case410-BGA, WLCSPNumber of I/O196Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-X30-3ASG410I – Avant™-X FPGA, 262,000 logic elements

The LAV-AT-X30-3ASG410I is an Avant™-X Field Programmable Gate Array (FPGA) offered in a compact 410‑WLCSP package. It implements the Lattice Avant platform architecture and delivers a high logic density with integrated on‑chip memory and flexible I/O to support demanding embedded and industrial designs.

With 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, 196 user I/Os, and industrial-grade temperature capability, this device targets applications that require programmable logic, significant on‑chip memory, and a small footprint while operating from a nominal 820 mV supply.

Key Features

  • Core Logic — 262,000 logic elements to implement complex programmable functions on the Avant platform.
  • Embedded Memory — Approximately 1.74 Mbits of on‑chip RAM (1,740,800 total RAM bits) for buffering, FIFOs, and local data storage.
  • I/O Density — 196 user I/Os to support multiple interfaces and peripheral connections.
  • Clocking and Timing — Architecture documentation includes on‑chip oscillator, PLL, global and regional clock resources, and dynamic clock control features as part of the Avant platform.
  • High‑speed Interfaces — Device family documentation references SERDES/PMA blocks, Multi‑Protocol PCS (MPPCS), Multi‑Protocol PHY (MPPHY) integration, and DDRPHY support for system interface flexibility.
  • Package and Mounting — 410‑BGA / 410‑WLCSP supplier package (11×9) in a surface‑mount form factor for compact board designs.
  • Industrial Grade — Qualified for operation over a temperature range of −40°C to 100°C for industrial applications.
  • Low‑Voltage Supply — Device supply specified at 820 mV.
  • Regulatory — RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Use the device’s industrial temperature range, dense logic resources, and plentiful I/O to implement motor control, PLC functions, and deterministic logic for factory automation.
  • High‑Density Embedded Processing — Leverage 262,000 logic elements and ~1.74 Mbits of embedded RAM for on‑chip data processing, custom accelerators, and parallel data paths.
  • Interface Bridging and Protocol Conversion — Built‑in SERDES, MPPCS/MPPHY references, and DDRPHY support enable protocol adaptation and high‑speed link connectivity between subsystems.
  • Compact System Integration — The 410‑WLCSP package and surface‑mount mount style allow integration into space‑constrained platforms where board area and height are limited.

Unique Advantages

  • High logic density: 262,000 logic elements provide substantial routing and compute fabric for complex programmable designs.
  • Substantial embedded memory: Approximately 1.74 Mbits of on‑chip RAM reduces the need for external memory for many buffering and state storage requirements.
  • Flexible I/O resources: 196 I/Os enable multiple peripheral interfaces and system interconnects without immediate external multiplexing.
  • Platform-level interface support: Documentation for the Avant platform includes SERDES, DDRPHY, and multi‑protocol PHY/PCS building blocks to simplify high‑speed interface implementation.
  • Industrial robustness: Rated for −40°C to 100°C operation to meet environmental demands typical of industrial deployments.
  • Small, surface‑mount package: 410‑WLCSP (11×9) offers a compact footprint for space‑constrained boards while maintaining a high pin count.

Why Choose LAV-AT-X30-3ASG410I?

The LAV-AT-X30-3ASG410I brings the Avant™ platform’s architectural features into a compact, industrial‑grade FPGA offering. Its combination of 262,000 logic elements, approximately 1.74 Mbits of embedded RAM, and 196 I/Os provides designers with ample programmable resources for complex embedded functions, interface concentration, and on‑chip acceleration without relying solely on external components.

This device is well suited to engineers and system designers building industrial and space‑constrained systems that need a scalable programmable fabric, integrated memory, and documented high‑speed interface building blocks from the Avant platform.

If you would like pricing, availability, or to request a quote for the LAV-AT-X30-3ASG410I, submit a quote request or sales inquiry and our team will respond with details tailored to your project needs.

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