LAV-AT-X30-2LFG676C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA |
|---|---|
| Quantity | 879 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-X30-2LFG676C – Avant™-X FPGA, 262,000 logic elements, 676-FCBGA
The LAV-AT-X30-2LFG676C is an Avant™-X Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a high-density programmable logic fabric combined with on-chip memory and extensive I/O in a 676-FCBGA (27×27) surface-mount package.
Built on the Lattice Avant platform, the device incorporates modular architecture elements described in the platform datasheet — including programmable functional unit blocks, on-chip memory, DSP resources, versatile clocking and I/O subsystems — enabling configurable logic implementations and embedded-system integration for commercial-grade applications.
Key Features
- Logic Capacity — 262,000 logic elements for implementing complex programmable logic designs.
- Embedded Memory — Approximately 1.74 Mbits of embedded RAM (1,740,800 total bits) to support frame buffers, FIFOs and local data storage.
- I/O Count and Programmability — 298 user I/O pins with the Avant platform’s programmable I/O cell architecture and sysI/O banking scheme as documented in the Avant platform overview.
- Platform Subsystems — Architecture described in the Avant datasheet includes programmable functional unit (PFU) blocks, sysDSP, sysMEM, routing resources, and programmable I/O cells (PIC) to support a wide range of logic and signal-processing functions.
- Clocking and Timing — On-chip oscillator, PLLs, global and regional clock structures, dynamic clock control and synchronizers outlined by the Avant platform for flexible clock management.
- High-speed Interfaces and Memory Support — Datasheet references SERDES/PMA blocks, multi-protocol PCS/PHY integration and DDRPHY support for external memory interfaces where required by system designs.
- Package and Mounting — 676-BBGA / 676-FCBGA package (27×27) intended for surface-mount assembly.
- Power and Temperature — Specified supply condition at 820 mV and commercial operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Configurable Logic and Prototyping — Implement custom logic functions and rapid prototyping using the device’s large logic element count and programmable fabric.
- Embedded Signal Processing — Use embedded sysDSP resources and on-chip RAM to accelerate DSP and real-time data handling tasks.
- High-Density I/O Systems — Leverage 298 I/O pins and programmable I/O cells for interface bridging, sensor aggregation, and complex peripheral connectivity.
- Memory Interface Designs — Integrate external DDR memory subsystems with the device’s DDRPHY and DQS grouping support described in the platform overview.
Unique Advantages
- High Logic Density: 262,000 logic elements allow integration of complex logic functions into a single FPGA, reducing system BOM and board area.
- Substantial On‑Chip Memory: Approximately 1.74 Mbits of embedded RAM supports local buffering, FIFOs and small data structures without external memory.
- Extensive, Programmable I/O: 298 I/O pins and the Avant programmable I/O architecture enable flexible interfacing and signal-standard support for varied peripherals.
- Modular Platform Architecture: The Avant platform’s PFU, sysMEM and sysDSP blocks provide a structured architecture for implementing diverse logic, memory and DSP workloads.
- Integrated Clocking and Interface Support: On-chip oscillator, PLLs, regional/global clocks and SERDES/PHY capabilities facilitate complex timing and high-speed interface designs.
- Commercial-Grade Availability: Surface-mount 676-FCBGA package and 0 °C to 85 °C operating range suit mainstream, commercial embedded applications.
Why Choose LAV-AT-X30-2LFG676C?
The LAV-AT-X30-2LFG676C combines large logic capacity, significant on-chip memory, and a high I/O count in a compact 676-FCBGA package, making it well suited for commercial embedded designs that require configurable logic, DSP acceleration and flexible I/O. Its architecture, as described in the Avant platform overview, delivers modular blocks for routing, memory, clocking and high-speed interface support to simplify system integration.
This device is a fit for designers seeking a commercially graded FPGA solution that balances integration density and platform-level features. Its combination of logic, embedded RAM and documented platform subsystems supports scalable designs and streamlines development for a range of applications requiring programmable logic and connectivity.
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