LAV-AT-X30-2LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 879 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-X30-2LFG676C – Avant™-X FPGA, 262,000 logic elements, 676-FCBGA

The LAV-AT-X30-2LFG676C is an Avant™-X Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides a high-density programmable logic fabric combined with on-chip memory and extensive I/O in a 676-FCBGA (27×27) surface-mount package.

Built on the Lattice Avant platform, the device incorporates modular architecture elements described in the platform datasheet — including programmable functional unit blocks, on-chip memory, DSP resources, versatile clocking and I/O subsystems — enabling configurable logic implementations and embedded-system integration for commercial-grade applications.

Key Features

  • Logic Capacity — 262,000 logic elements for implementing complex programmable logic designs.
  • Embedded Memory — Approximately 1.74 Mbits of embedded RAM (1,740,800 total bits) to support frame buffers, FIFOs and local data storage.
  • I/O Count and Programmability — 298 user I/O pins with the Avant platform’s programmable I/O cell architecture and sysI/O banking scheme as documented in the Avant platform overview.
  • Platform Subsystems — Architecture described in the Avant datasheet includes programmable functional unit (PFU) blocks, sysDSP, sysMEM, routing resources, and programmable I/O cells (PIC) to support a wide range of logic and signal-processing functions.
  • Clocking and Timing — On-chip oscillator, PLLs, global and regional clock structures, dynamic clock control and synchronizers outlined by the Avant platform for flexible clock management.
  • High-speed Interfaces and Memory Support — Datasheet references SERDES/PMA blocks, multi-protocol PCS/PHY integration and DDRPHY support for external memory interfaces where required by system designs.
  • Package and Mounting — 676-BBGA / 676-FCBGA package (27×27) intended for surface-mount assembly.
  • Power and Temperature — Specified supply condition at 820 mV and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Configurable Logic and Prototyping — Implement custom logic functions and rapid prototyping using the device’s large logic element count and programmable fabric.
  • Embedded Signal Processing — Use embedded sysDSP resources and on-chip RAM to accelerate DSP and real-time data handling tasks.
  • High-Density I/O Systems — Leverage 298 I/O pins and programmable I/O cells for interface bridging, sensor aggregation, and complex peripheral connectivity.
  • Memory Interface Designs — Integrate external DDR memory subsystems with the device’s DDRPHY and DQS grouping support described in the platform overview.

Unique Advantages

  • High Logic Density: 262,000 logic elements allow integration of complex logic functions into a single FPGA, reducing system BOM and board area.
  • Substantial On‑Chip Memory: Approximately 1.74 Mbits of embedded RAM supports local buffering, FIFOs and small data structures without external memory.
  • Extensive, Programmable I/O: 298 I/O pins and the Avant programmable I/O architecture enable flexible interfacing and signal-standard support for varied peripherals.
  • Modular Platform Architecture: The Avant platform’s PFU, sysMEM and sysDSP blocks provide a structured architecture for implementing diverse logic, memory and DSP workloads.
  • Integrated Clocking and Interface Support: On-chip oscillator, PLLs, regional/global clocks and SERDES/PHY capabilities facilitate complex timing and high-speed interface designs.
  • Commercial-Grade Availability: Surface-mount 676-FCBGA package and 0 °C to 85 °C operating range suit mainstream, commercial embedded applications.

Why Choose LAV-AT-X30-2LFG676C?

The LAV-AT-X30-2LFG676C combines large logic capacity, significant on-chip memory, and a high I/O count in a compact 676-FCBGA package, making it well suited for commercial embedded designs that require configurable logic, DSP acceleration and flexible I/O. Its architecture, as described in the Avant platform overview, delivers modular blocks for routing, memory, clocking and high-speed interface support to simplify system integration.

This device is a fit for designers seeking a commercially graded FPGA solution that balances integration density and platform-level features. Its combination of logic, embedded RAM and documented platform subsystems supports scalable designs and streamlines development for a range of applications requiring programmable logic and connectivity.

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