LAV-AT-X30-1LFG676C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,245 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 262000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1740800 |
Overview of LAV-AT-X30-1LFG676C – Avant™-X FPGA, 262k Logic Elements, 676-FCBGA
The LAV-AT-X30-1LFG676C Avant™-X Field Programmable Gate Array (FPGA) is a commercial-grade, surface-mount FPGA device on the Lattice Avant platform. It combines a high logic element count with on-chip memory, programmable I/O and platform-level features such as clocking, DDR PHY support and SERDES/PCS building blocks to address designs that require dense programmable logic and flexible interface support.
This device is positioned for designers who need a compact, high-capacity FPGA solution in a 676-FCBGA package, with support for memory subsystems, high-speed serial/link blocks and a rich set of on-chip resources documented in the Avant platform overview.
Key Features
- Logic Capacity — 262,000 logic element cells providing substantial programmable fabric for complex logic and control functions.
- Embedded Memory — Approximately 1.74 Mbits of total on-chip RAM (1,740,800 bits) for data buffering, state storage and local memory needs.
- IO Resources — 298 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
- Programmable I/O and PHYs — Includes programmable I/O cell (PIC) structures and sysI/O banking; datasheet documents DDRPHY, SERDES/PMA and multi-protocol PCS/PHY building blocks for diverse interface options.
- Clocking and Timing — On-chip oscillator, PLL, global/regional/edge clock domains, clock synchronizers/dividers, dynamic clock select/control and DLL delay features described in the platform documentation.
- On-Chip DSP and Memory Subsystems — Platform-level sysDSP and sysMEM blocks provide documented support for DSP workloads, memory cascading, single/dual/pseudo-dual port modes and FIFO operation.
- Device Configuration and Reliability — Enhanced configuration options, JTAG support and Single Event Upset (SEU) handling are described in the Avant platform documentation.
- Package and Mounting — 676-FCBGA (27×27) package, surface mount; package case listed as 676-BBGA/FCBGA.
- Supply and Temperature — Voltage supply specified at 820 mV; operating temperature range 0 °C to 85 °C. Grade: Commercial.
- Compliance — RoHS compliant.
Typical Applications
- High-Speed Communication Interfaces — Use SERDES, PCS and multi-protocol PHY resources for serial links and protocol bridging.
- Memory Subsystems and Controllers — Leverage DDRPHY and sysMEM capabilities for DDR interfaces, memory buffering and FIFO-based data paths.
- Signal Processing and Acceleration — Implement DSP functions using on-chip sysDSP blocks combined with the device’s logic and embedded RAM.
- Embedded Control and I/O Aggregation — Large I/O count and programmable I/O cells enable complex peripheral aggregation, sensor interfacing and control logic.
Unique Advantages
- High Logic Density: 262,000 logic elements enable complex control, processing and routing functions on a single device, reducing system BOM.
- Integrated Memory Resources: Approximately 1.74 Mbits of embedded RAM support buffering, state machines and local data storage without external memory for many use cases.
- Comprehensive Interface Support: On-chip DDRPHY, SERDES/PMA and multi-protocol PCS building blocks provide the foundation for diverse high-speed interfaces.
- Flexible Clocking Architecture: Multiple clocking features—including PLLs, on-chip oscillator and dynamic clock control—help implement synchronized multi-domain systems.
- Compact, Surface-Mount Package: 676-FCBGA (27×27) package offers a small footprint for high-density board designs while providing plentiful I/O.
- Commercial Grade with RoHS Compliance: Designed for commercial-temperature applications (0 °C to 85 °C) and RoHS compliance for global manufacturing requirements.
Why Choose LAV-AT-X30-1LFG676C?
The LAV-AT-X30-1LFG676C delivers a balance of logic capacity, embedded memory and rich interface building blocks from the Lattice Avant platform. Its combination of 262,000 logic elements, approximately 1.74 Mbits of on-chip RAM and 298 I/Os makes it suitable for designs that need significant programmable resources in a compact FCBGA package.
Designed for commercial applications requiring programmable logic, DDR memory support and high-speed serial interfaces, this Avant™-X device gives designers platform-level documentation and architecture features—clocking, configuration options, sysDSP and sysMEM—to implement complex, tightly integrated systems.
Request a quote or submit an inquiry to get pricing and availability for the LAV-AT-X30-1LFG676C Avant™-X FPGA. Our team can provide lead-time details and support for your design planning needs.

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