LAV-AT-X30-1LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 1740800 262000 676-BBGA, FCBGA

Quantity 1,245 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells262000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1740800

Overview of LAV-AT-X30-1LFG676C – Avant™-X FPGA, 262k Logic Elements, 676-FCBGA

The LAV-AT-X30-1LFG676C Avant™-X Field Programmable Gate Array (FPGA) is a commercial-grade, surface-mount FPGA device on the Lattice Avant platform. It combines a high logic element count with on-chip memory, programmable I/O and platform-level features such as clocking, DDR PHY support and SERDES/PCS building blocks to address designs that require dense programmable logic and flexible interface support.

This device is positioned for designers who need a compact, high-capacity FPGA solution in a 676-FCBGA package, with support for memory subsystems, high-speed serial/link blocks and a rich set of on-chip resources documented in the Avant platform overview.

Key Features

  • Logic Capacity — 262,000 logic element cells providing substantial programmable fabric for complex logic and control functions.
  • Embedded Memory — Approximately 1.74 Mbits of total on-chip RAM (1,740,800 bits) for data buffering, state storage and local memory needs.
  • IO Resources — 298 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Programmable I/O and PHYs — Includes programmable I/O cell (PIC) structures and sysI/O banking; datasheet documents DDRPHY, SERDES/PMA and multi-protocol PCS/PHY building blocks for diverse interface options.
  • Clocking and Timing — On-chip oscillator, PLL, global/regional/edge clock domains, clock synchronizers/dividers, dynamic clock select/control and DLL delay features described in the platform documentation.
  • On-Chip DSP and Memory Subsystems — Platform-level sysDSP and sysMEM blocks provide documented support for DSP workloads, memory cascading, single/dual/pseudo-dual port modes and FIFO operation.
  • Device Configuration and Reliability — Enhanced configuration options, JTAG support and Single Event Upset (SEU) handling are described in the Avant platform documentation.
  • Package and Mounting — 676-FCBGA (27×27) package, surface mount; package case listed as 676-BBGA/FCBGA.
  • Supply and Temperature — Voltage supply specified at 820 mV; operating temperature range 0 °C to 85 °C. Grade: Commercial.
  • Compliance — RoHS compliant.

Typical Applications

  • High-Speed Communication Interfaces — Use SERDES, PCS and multi-protocol PHY resources for serial links and protocol bridging.
  • Memory Subsystems and Controllers — Leverage DDRPHY and sysMEM capabilities for DDR interfaces, memory buffering and FIFO-based data paths.
  • Signal Processing and Acceleration — Implement DSP functions using on-chip sysDSP blocks combined with the device’s logic and embedded RAM.
  • Embedded Control and I/O Aggregation — Large I/O count and programmable I/O cells enable complex peripheral aggregation, sensor interfacing and control logic.

Unique Advantages

  • High Logic Density: 262,000 logic elements enable complex control, processing and routing functions on a single device, reducing system BOM.
  • Integrated Memory Resources: Approximately 1.74 Mbits of embedded RAM support buffering, state machines and local data storage without external memory for many use cases.
  • Comprehensive Interface Support: On-chip DDRPHY, SERDES/PMA and multi-protocol PCS building blocks provide the foundation for diverse high-speed interfaces.
  • Flexible Clocking Architecture: Multiple clocking features—including PLLs, on-chip oscillator and dynamic clock control—help implement synchronized multi-domain systems.
  • Compact, Surface-Mount Package: 676-FCBGA (27×27) package offers a small footprint for high-density board designs while providing plentiful I/O.
  • Commercial Grade with RoHS Compliance: Designed for commercial-temperature applications (0 °C to 85 °C) and RoHS compliance for global manufacturing requirements.

Why Choose LAV-AT-X30-1LFG676C?

The LAV-AT-X30-1LFG676C delivers a balance of logic capacity, embedded memory and rich interface building blocks from the Lattice Avant platform. Its combination of 262,000 logic elements, approximately 1.74 Mbits of on-chip RAM and 298 I/Os makes it suitable for designs that need significant programmable resources in a compact FCBGA package.

Designed for commercial applications requiring programmable logic, DDR memory support and high-speed serial interfaces, this Avant™-X device gives designers platform-level documentation and architecture features—clocking, configuration options, sysDSP and sysMEM—to implement complex, tightly integrated systems.

Request a quote or submit an inquiry to get pricing and availability for the LAV-AT-X30-1LFG676C Avant™-X FPGA. Our team can provide lead-time details and support for your design planning needs.

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