LAV-AT-X50-1LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA

Quantity 470 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-X50-1LFG676C – Avant™-X FPGA, 676-FCBGA (27×27)

The LAV-AT-X50-1LFG676C is an Avant™-X Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, supplied in a 676-FCBGA (27×27) package for surface-mount applications. It delivers a high-density programmable fabric with 409,000 logic elements, approximately 2.7 Mbits of embedded RAM, and 298 general-purpose I/O pins—targeted at complex embedded and communications designs that require high integration in a compact BGA footprint.

Built on the Lattice Avant platform, the device architecture provides a broad set of on-chip capabilities including programmable clocking, memory and DSP primitives, programmable I/O, and interfaces for DDR and serial links as described in the Avant platform documentation.

Key Features

  • Logic Capacity — 409,000 logic element cells to implement large-scale digital functions and custom hardware accelerators.
  • Embedded Memory — Approximately 2.7 Mbits of total on-chip RAM for buffering, FIFOs, and local storage with support for single/dual/pseudo-dual port modes described in the platform documentation.
  • I/O Density — 298 I/O pins supporting a wide range of interfacing requirements in a single device.
  • Package & Mounting — 676-BBGA / 676-FCBGA (27×27) package, surface-mount suitable for compact board designs.
  • Voltage & Power — Core voltage specified at 0.820 V; device-level power characteristics are determined by design implementation.
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.
  • Platform Capabilities — Avant platform architecture includes programmable functional units, on-chip oscillator, PLLs, global and regional clocking, sysMEM memory blocks, sysDSP resources, programmable I/O cells, DDRPHY support, and SERDES/PCS building blocks as detailed in the Avant documentation.
  • Configuration & Reliability — Device configuration and management features described in the platform reference include enhanced configuration options, JTAG access, and SEU handling approaches.

Typical Applications

  • High-performance signal processing — Implement dense DSP pipelines and hardware accelerators using the large logic fabric and embedded sysDSP resources.
  • Networking and communications — Support protocol processing, packet handling, and multi‑lane serial interfaces leveraging the platform's SERDES/PCS and high I/O count.
  • Memory interface and buffering — Use on-chip sysMEM blocks and DDRPHY support for memory controllers, FIFOs, and high-throughput data staging.
  • Compact embedded systems — Integrate control, glue logic, and peripheral interfaces into a single BGA package for space-constrained boards.

Unique Advantages

  • High integration density: 409,000 logic elements and ~2.7 Mbits of embedded RAM reduce external components and simplify board-level designs.
  • Extensive I/O connectivity: 298 I/O pins support diverse interfaces and multiple peripherals without external multiplexing.
  • Compact BGA package: 676-FCBGA (27×27) enables a small PCB footprint while maintaining high pin count for system-level consolidation.
  • Avant platform feature set: Built-in clock management, memory primitives, DSP blocks, DDRPHY and SERDES/PCS building blocks streamline implementation of complex applications.
  • Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for mainstream embedded and consumer products.

Why Choose LAV-AT-X50-1LFG676C?

The LAV-AT-X50-1LFG676C positions itself as a high-capacity, platform-backed FPGA suitable for designs that require significant logic resources, abundant on-chip memory, and a large I/O complement in a compact package. Its inclusion in the Lattice Avant platform gives designers access to architectural building blocks—clocking, memory, DSP, DDR and serial PHY support—documented for system integration.

This device is well suited to engineering teams targeting high-density embedded processing, communications, and memory-intensive applications that benefit from a single-chip programmable solution and the design guidance available in the Avant platform documentation.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for LAV-AT-X50-1LFG676C.

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