LAV-AT-X50-2CSG484C

The LAV-AT-X50-2CSG484C is an Avant™-X field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a high logic capacity device with extensive on-chip memory and a high pin‑count, surface‑mount package designed for commercial embedded applications.

With 409,000 logic elements, approximately 2.72 Mbits of embedded memory and 218 I/Os, this device targets designs that require dense programmable logic, diverse I/O standards and compact package integration while operating on a low-voltage supply and a commercial temperature range.

Key Features

• Logic Capacity — 409,000 logic elements (cells) to implement complex programmable logic and custom hardware functions.
• Embedded Memory — Approximately 2.72 Mbits of on‑chip RAM for buffering, state storage and intermediate data processing.
• I/O Resources — 218 general-purpose I/O pins supporting multiple sysI/O standards as described in the Avant platform data sheet, enabling flexible interface options.
• High-Speed Serial & Protocol Support — Datasheet includes hardened PCIe characteristics (supported link rates listed at 2.5, 5, 8 and 16 Gbps) and multiple differential I/O standards such as LVDS, SubLVDS, SLVS and Soft MIPI D‑PHY.
• Power — Operates from a documented supply voltage of 820 mV.
• Package & Mounting — 484‑BGA / 484‑FCCSP (12×12) supplier device package in a surface‑mount form factor for compact board layouts.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High‑speed serial interfacing — Use the device’s hardened PCIe characteristics and multi‑standard sysI/O support for implementing serial protocol endpoints and bridges.
• Custom programmable logic — Leverage 409,000 logic elements and on‑chip RAM for implementing application‑specific accelerators, protocol processing or control logic.
• Compact embedded systems — The 484‑FCCSP (12×12) surface‑mount package and 218 I/Os enable dense board integration in space‑constrained designs operating in commercial environments.
• Multi‑standard interface integration — Support for LVDS, SubLVDS, SLVS and MIPI D‑PHY (as described in the Avant platform documentation) simplifies mixed‑signal and multi‑protocol designs.

Unique Advantages

• High programmable density: 409,000 logic elements provide substantial capacity for complex designs without external logic proliferation.
• Integrated memory for buffering: Approximately 2.72 Mbits of embedded RAM reduces dependence on external memory for many common functions.
• Versatile I/O and protocol support: 218 I/Os and documented sysI/O and hardened PCIe characteristics enable wide protocol and interface flexibility directly on chip.
• Compact, surface‑mount package: 484‑FCCSP (12×12) package supports high pin count in a compact footprint for dense PCB designs.
• Commercial temperature readiness: Rated for 0 °C to 85 °C operation to meet standard embedded system thermal requirements.
• RoHS compliance: Environmentally compliant manufacturing compatibility for global product requirements.

Why Choose LAV-AT-X50-2CSG484C?

The LAV-AT-X50-2CSG484C combines high logic capacity, substantial on‑chip RAM and a broad complement of I/O in a compact 484‑FCCSP surface‑mount package, making it well suited for commercial embedded designs that require dense programmable logic and multi‑standard interface support. Its documented support for hardened PCIe characteristics and multiple differential I/O standards provides a clear pathway for integrating high‑speed serial links and mixed‑signal interfaces directly within the FPGA fabric.

Designed for engineers who need a programmable, high‑capacity solution in a compact board footprint, this Avant™‑X device offers the core building blocks to reduce external component count and simplify system integration while meeting commercial temperature and environmental requirements.

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