LAV-AT-X50-1LFG676I

The LAV-AT-X50-1LFG676I is an Avant™-X Field Programmable Gate Array (FPGA) from Lattice Semiconductor, offered in a 676-FCBGA (27×27) package. It delivers a large programmable fabric paired with integrated memory and on-chip system resources drawn from the Lattice Avant platform.

Targeted for industrial applications, this device provides 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and up to 298 I/Os, making it suitable for embedded control, high-I/O systems, and designs that require configurable logic, on-chip DSP and memory resources within an industrial temperature envelope.

Key Features

• Programmable Fabric — 409,000 logic elements provide substantial capacity for custom digital logic and system integration.
• Embedded Memory — Approximately 2.72 Mbits of on-chip RAM for storing state, buffers, and local data structures.
• I/O and Packaging — Up to 298 general-purpose I/Os in a 676-BBGA / 676-FCBGA (27×27) package, optimized for surface-mount board designs.
• Industrial Temperature Range — Specified operation from −40 °C to 100 °C for deployment in industrial environments.
• Supply Voltage — Device supply noted at 820 mV.
• Clocking and Timing — Avant platform includes on-chip oscillator, PLL, global and regional clocking structures, and dynamic clock control to support diverse timing architectures.
• Memory and DSP Blocks — sysMEM and sysDSP blocks on the Avant platform provide flexible RAM modes (single/dual/pseudo-dual, FIFO) and DSP capabilities for signal processing tasks.
• DDR and PHY Support — DDR memory support with DDRPHY and DQS grouping as described in the Avant platform overview for external memory interfaces.
• Programmable I/O Cells (PIC) — Advanced I/O cell architecture with input/output/tri-state register options and a banking scheme for supported sysI/O standards.
• Configuration and Reliability — Enhanced configuration options including JTAG and SEU handling features referenced in the Avant platform documentation.
• High-speed Serial and Protocol Blocks — SERDES/PMA and Multi-Protocol PCS/PHY integration are part of the platform capabilities described in the device overview.
• Mounting — Surface mount package for standard PCB assembly processes.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• Industrial Control and Automation — The industrial temperature rating and large logic capacity enable control, sequencing, and protocol bridging in factory and automation systems.
• High‑I/O Interface Hubs — Up to 298 I/Os and flexible PICs support systems requiring dense external connectivity and custom I/O protocols.
• Memory‑Intensive Embedded Systems — On-chip sysMEM and DDRPHY support make the device suitable for embedded designs that combine local RAM usage and external DDR memory interfacing.
• Signal Processing and DSP Offload — sysDSP blocks and programmable fabric allow implementation of custom DSP kernels and data-path acceleration.

Unique Advantages

• Large, Scalable Logic Capacity: 409,000 logic elements afford designers room to integrate complex control, glue logic, and custom processing on a single device.
• Integrated On‑Chip Memory: Approximately 2.72 Mbits of embedded RAM reduce external memory dependence for many system functions.
• Flexible I/O and Package Options: 298 I/Os in a 676-FCBGA (27×27) package enable compact, high-density board layouts while supporting extensive external connectivity.
• Industrial‑Grade Operation: Specified −40 °C to 100 °C operation supports deployment in a wide range of industrial environments.
• Comprehensive Avant Platform Capabilities: On-chip oscillator, PLLs, clock hierarchy, DDRPHY, sysMEM, sysDSP, and SERDES/PCS elements provide a cohesive set of resources for system implementation.
• Configuration and Reliability Features: Platform-level support for JTAG and SEU handling options aids device configuration and reliability strategies.

Why Choose LAV-AT-X50-1LFG676I?

The LAV-AT-X50-1LFG676I combines a high-capacity programmable fabric with integrated memory and platform-level peripherals drawn from the Lattice Avant architecture. Its combination of 409,000 logic elements, roughly 2.72 Mbits of embedded RAM, extensive I/O and DDRPHY support makes it well suited for industrial embedded designs that require on-board signal processing, memory interfacing, and dense connectivity.

Designed for engineers who need a compact, surface-mount FPGA solution with documented Avant platform features—clocking, programmable I/O cells, sysMEM/sysDSP blocks, and high-speed serial capabilities—this device supports scalable system integration while meeting industrial temperature requirements.

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