LAV-AT-X50-2CSG484I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BGA, FCCSPBGA

Quantity 541 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCCSP (12x12)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGA, FCCSPBGANumber of I/O218Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-X50-2CSG484I – Avant™-X Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BGA, FCCSPBGA

The LAV-AT-X50-2CSG484I is an Avant™-X FPGA from Lattice Semiconductor designed for high-density programmable logic in industrial environments. It combines 409,000 logic elements with approximately 2.72 Mbits of embedded memory and 218 I/O pins to address designs requiring significant on-chip logic and memory capacity.

Key technical attributes include a 484-FCCSP (12×12) surface-mount package, an operating temperature range of −40 °C to 100 °C, a supply voltage of 820 mV, and RoHS compliance. The Avant Platform datasheet also documents system-level features such as sysCLOCK PLLs, internal oscillators, and hardened PCIe characteristics up to 16 Gbps.

Key Features

  • Core Capacity – 409,000 logic elements for implementing complex programmable logic and system functions.
  • Embedded Memory – Approximately 2.72 Mbits of on-chip RAM to support buffering, state storage, and data processing tasks.
  • I/O Density – 218 I/O pins to connect sensors, peripherals, and high-speed serial interfaces.
  • Package and Mounting – 484-FCCSP (12×12) BGA surface-mount package suitable for compact board designs requiring high pin count.
  • Industrial Temperature Range – Rated for −40 °C to 100 °C operation, supporting deployment in industrial applications.
  • Power – Voltage supply specified at 820 mV.
  • Platform-Level Interfaces – Avant Platform datasheet includes documented sysI/O standards (LVDS, SubLVDS, SLVS, Soft MIPI D‑PHY and other differential I/O types), sysCLOCK PLL timing, internal oscillators, and hardened PCIe characteristics spanning 2.5 Gbps to 16 Gbps.
  • Regulatory – RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Industrial Control and Automation – Industrial-grade temperature rating and high logic capacity enable custom control, sequencing, and protocol bridging in factory or process environments.
  • High-Speed Connectivity – Datasheet coverage of hardened PCIe characteristics (2.5–16 Gbps) and multiple differential I/O standards supports integration in systems requiring high-bandwidth serial links.
  • Imaging and Sensor Interfaces – Documented Soft MIPI D‑PHY and differential I/O options make the device suitable for camera and sensor interface processing where on-chip memory and logic are required.
  • Embedded Memory-Intensive Functions – Approximately 2.72 Mbits of embedded RAM supports buffering, packet handling, and local data processing workloads.

Unique Advantages

  • High Logic Density: 409,000 logic elements provide a large programmable fabric for integrating multiple system functions on a single device, reducing external components.
  • Substantial On‑Chip Memory: Approximately 2.72 Mbits of embedded RAM enables local data storage for state machines, FIFOs, and temporary buffering without relying on external memory.
  • Broad I/O Count: 218 I/O pins give designers flexibility to connect a wide set of peripherals, interfaces, and sensors directly to the FPGA.
  • Industrial Reliability: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with regulatory and thermal requirements.
  • Platform-Level Interface Support: Datasheet-documented sysI/O standards and hardened PCIe characteristics simplify implementation of high-speed interfaces and timing-critical subsystems.
  • Compact High-Pin Package: 484-FCCSP (12×12) BGA delivers high I/O density in a compact footprint for space-constrained boards.

Why Choose LAV-AT-X50-2CSG484I?

The LAV-AT-X50-2CSG484I positions itself as a high-density, industrial-grade FPGA option within the Lattice Avant platform, offering 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 218 I/O in a compact 484-FCCSP package. Its documented platform features—such as sysCLOCK PLLs, internal oscillators, multiple sysI/O standards, and hardened PCIe characteristics—support designs that require integrated high-speed connectivity and robust timing resources.

This device is suited for engineers and system designers building industrial and connectivity-focused applications that demand substantial on-chip logic and memory, a broad set of I/O, and operational reliability across a wide temperature range. The combination of platform-level documentation and device-level specifications provides a clear foundation for system-level integration and long-term product support.

Request a quote or submit an inquiry for the LAV-AT-X50-2CSG484I to receive pricing and availability details tailored to your design requirements.

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