LAV-AT-X50-2LFG676I
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,693 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-X50-2LFG676I – Avant™-X FPGA, 676‑FCBGA
The LAV-AT-X50-2LFG676I is an Avant™-X Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. Built on the Avant platform, the device delivers a high logic density fabric with integrated memory, programmable I/O, and on-chip clocking and PHY capabilities suitable for complex digital designs.
With 409,000 logic element cells, approximately 2.72 Mbits of embedded RAM, and 298 general-purpose I/Os in a 676‑FCBGA (27×27) surface-mount package, this industrial-grade FPGA supports designs requiring substantial logic, memory bandwidth, and system-level interfacing across an extended temperature range of −40 °C to 100 °C.
Key Features
- Core Logic Density — 409,000 logic element cells provide substantial programmable fabric for complex control, protocol handling, and custom datapath implementations.
- Embedded Memory — Total RAM bits: 2,723,840 (approximately 2.72 Mbits) to support on-chip buffering, FIFOs, and memory-intensive functions.
- I/O and Package — 298 I/O pins in a 676‑FCBGA (27×27) surface-mount package, enabling extensive peripheral and high-pin-count system connectivity.
- Clocking and Timing — On-chip oscillator, PLLs, global and regional clock resources, and dynamic clock controls as described in the Avant platform architecture for flexible timing and clock-domain management.
- High-Speed Interfaces and PHY Integration — Platform-level support for SERDES/PMA, Multi-Protocol PCS and Multi-Protocol PHY integration, and DDR memory support including DDRPHY and DQS grouping.
- Programmable I/O and Standards — Programmable I/O cell (PIC) and sysI/O banking scheme with input/output/tristate register blocks to match system I/O requirements.
- Configuration and Reliability — Enhanced configuration options, JTAG support, and SEU handling mechanisms referenced in the Avant platform documentation.
- Power and Supply — Specified voltage supply: 820 mV.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial applications.
- Compliance — RoHS compliant.
Typical Applications
- High‑speed connectivity and networking — Use the device’s SERDES/PMA and Multi‑Protocol PHY features for protocol bridging, link aggregation, and custom packet processing.
- Memory interface and buffering — Leverage DDRPHY support and approximately 2.72 Mbits of on‑chip RAM for DDR memory controllers, frame buffering, and data staging.
- Signal processing and acceleration — The high logic element count and sysDSP resources (platform-level) enable custom DSP datapaths, filtering, and real‑time processing functions.
- Industrial control and automation — Industrial temperature rating and extensive I/O make the FPGA suitable for control, gatekeeping, and interface consolidation in industrial systems.
Unique Advantages
- High logic capacity: 409,000 logic element cells offer the headroom to implement large custom state machines, protocol stacks, and datapaths without external logic.
- Integrated memory footprint: Approximately 2.72 Mbits of embedded RAM reduces external memory dependence for many buffering and storage tasks.
- Rich I/O and compact package: 298 I/Os in a 676‑FCBGA (27×27) delivers dense connectivity in a surface-mount form factor for space-constrained boards.
- Platform-level interface support: Built-in SERDES, DDRPHY, and Multi‑Protocol PHY/PCS blocks simplify implementation of high-speed interfaces and multi-protocol designs.
- Flexible clock and timing architecture: On-chip oscillator, PLLs, global/regional clocks, and dynamic clock control enable adaptable timing strategies across complex designs.
- Industrial robustness: Specified operation from −40 °C to 100 °C and RoHS compliance align the device with industrial deployment requirements.
Why Choose LAV-AT-X50-2LFG676I?
The LAV-AT-X50-2LFG676I positions itself as a high-density, platform-capable FPGA suited to designs that require a combination of substantial logic resources, embedded memory, and comprehensive I/O and PHY integration. Its Avant platform features such as advanced clocking, DDR support, and SERDES/PCS blocks provide the architectural building blocks for connectivity, memory interface, and DSP-centric applications.
This device is appropriate for engineering teams and procurement seeking an industrial-grade FPGA in a 676‑FCBGA package that consolidates functionality, reduces external component count, and supports scalable designs built on the Avant architecture.
Request a quote or submit a purchase inquiry to evaluate LAV-AT-X50-2LFG676I availability and pricing for your next design.