LAV-AT-X50-3LBG484C

The LAV-AT-X50-3LBG484C is an Avant™-X Field Programmable Gate Array (FPGA) offered in a 484-ball FCBGA package. It provides a high logic capacity device architecture with substantial on-chip memory and a large I/O count for complex, programmable designs.

Key strengths documented in the product specification set include a large number of logic elements, approximately 2.72 Mbits of embedded memory, comprehensive sysI/O capabilities and platform-level documentation covering DC/switching characteristics, I/O standards, PLLs and hardened PCIe characteristics.

Key Features

• Logic Capacity — 409,000 logic elements to implement sizable programmable logic architectures and complex processing pipelines.
• Embedded Memory — Approximately 2.72 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Resources — 218 user I/O pins documented for flexible external interfacing and board-level integration.
• Package & Mounting — Supplied in a 484-BFBGA / 484-FCBGA package (19×19); surface-mount mounting type for compact board designs.
• Power — Core voltage specified at 820 mV (per product specification).
• Operating Range — Commercial operating temperature from 0 °C to 85 °C.
• Standards & I/O Options — Datasheet includes detailed sysI/O electrical characteristics and support information for differential and single-ended standards (LVDS, SubLVDS, SLVS, Soft MIPI D‑PHY and others).
• Platform Documentation — Comprehensive datasheet sections covering DC and switching characteristics, on-chip programmable termination, ESD performance, PLLs, internal oscillators and hardened PCIe characteristics (2.5–16 Gbps).
• Compliance — RoHS compliant.

Typical Applications

• PCIe-based systems — Suited for designs that leverage the device’s documented hardened PCIe characteristics (2.5–16 Gbps) for high-speed host or endpoint connectivity.
• Imaging and sensor interfaces — Datasheet coverage of Soft MIPI D‑PHY and multiple differential I/O standards makes the device applicable where MIPI or other high-speed serial inputs are required.
• High-density logic and memory functions — The combination of 409,000 logic elements and approximately 2.72 Mbits of embedded RAM supports complex algorithm implementation and local buffering.

Unique Advantages

• High programmable density: 409,000 logic elements enable implementation of sophisticated programmable designs without external logic expansion.
• On-chip memory for local data handling: Approximately 2.72 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O capacity: 218 I/O pins give designers flexibility for peripheral, sensor and high-speed interface connections.
• Documented high-speed interface characteristics: The platform datasheet specifies hardened PCIe characteristics across multiple data rates and detailed sysI/O electrical parameters, aiding integration and validation.
• Compact system footprint: 484-FCBGA (19×19) package and surface-mount delivery support dense board-level implementations.
• Regulatory and environmental consideration: RoHS compliance supports deployments where lead-free materials are required.

Why Choose LAV-AT-X50-3LBG484C?

The LAV-AT-X50-3LBG484C positions itself as a high-capacity, platform-documented FPGA option for designs that require large programmable logic resources, significant on-chip memory and a broad set of I/O capabilities. Its documented platform specifications—covering I/O standards, DC/switching characteristics, PLLs, internal oscillators and hardened PCIe characteristics—help streamline system-level integration and validation.

This device is appropriate for customers developing complex, programmable logic solutions in commercial-temperature environments who need a single-chip combination of logic density, embedded memory and flexible high-speed I/O options, backed by detailed platform documentation.

Request a quote or submit an inquiry to receive pricing and availability information for the LAV-AT-X50-3LBG484C. Technical datasheet and platform specification details are available to support your evaluation and design process.