LAV-AT-X50-3LFG676C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 480 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-X50-3LFG676C – Avant™-X FPGA, 409,000 logic elements, 298 I/O
The LAV-AT-X50-3LFG676C is an Avant™-X Field Programmable Gate Array (FPGA) IC offering approximately 409,000 logic elements and about 2.7 Mbits of embedded memory. It is supplied in a 676-FCBGA (27×27) surface-mount package and is provided as a commercial-grade device with a specified operating range of 0 °C to 85 °C.
Built on the Lattice Avant platform, the device includes the platform’s architectural building blocks such as Programmable Functional Unit (PFU) blocks, sysMEM and sysDSP resources, programmable I/O, clocking primitives (including an on‑chip oscillator and PLLs), DDRPHY support, and SERDES/PCS capabilities. These elements enable flexible implementation of logic, memory, I/O and high‑speed interface functions in compact systems.
Key Features
- Core Logic — Approximately 409,000 logic elements for large-scale programmable logic integration.
- Embedded Memory — Approximately 2.7 Mbits of on‑chip RAM (total RAM bits: 2,723,840) with support for single, dual and pseudo‑dual port modes, FIFO modes and RAM initialization options as described in the Avant platform documentation.
- I/O — 298 user I/O pins with the platform’s programmable I/O cell (PIC) architecture and multi‑standard sysI/O banking.
- Clocking and Timing — On‑chip oscillator, PLLs, global and regional clocking, edge clocks and dynamic clock control features described for the Avant platform to support complex timing domains.
- Memory Interface — DDR support via DDRPHY and DQS grouping for external memory interfaces as provided by the Avant platform.
- Signal Processing and Interfaces — sysDSP blocks and SERDES/PMA plus Multi‑Protocol PCS options for high‑performance datapath and serial link implementations.
- Configuration and Reliability — Enhanced configuration options, JTAG support and SEU handling features outlined in the Avant platform overview.
- Package and Mounting — 676‑BBGA / 676‑FCBGA (27×27) surface‑mount package suitable for compact board designs.
- Power and Temperature — Specified voltage supply of 820 mV and commercial operating temperature range 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High‑density logic integration — Implement large programmable logic functions that require hundreds of thousands of logic elements and on‑chip memory.
- Interface bridging and memory controllers — Leverage DDRPHY and sysMEM capabilities to implement external memory interfaces, buffering and protocol bridging.
- Signal processing pipelines — Use sysDSP resources for arithmetic and streaming datapath operations within embedded systems.
- High‑speed serial links — Employ SERDES/PMA and Multi‑Protocol PCS features for serial communication and protocol adaptation.
Unique Advantages
- Large programmable fabric: Approximately 409,000 logic elements enable consolidation of complex logic functions into a single device, reducing system BOM and board area.
- Integrated on‑chip memory: About 2.7 Mbits of embedded RAM supports local buffering, FIFOs and multi‑port memory configurations without external RAM for many use cases.
- Versatile I/O and interface options: 298 I/Os combined with programmable I/O cells, DDRPHY and SERDES/PCS blocks provide flexibility for diverse digital and high‑speed interface requirements.
- Comprehensive clocking and timing primitives: On‑chip oscillator, PLLs and multiple clock domains simplify timing architecture for multi‑domain designs.
- Commercial‑grade qualification: Specified for operation from 0 °C to 85 °C and RoHS compliant for mainstream embedded and electronic applications.
Why Choose LAV-AT-X50-3LFG676C?
The LAV-AT-X50-3LFG676C positions the Avant™-X platform’s architectural features—large logic capacity, significant embedded memory, programmable I/O, DDR and serial PHY support—into a single 676‑FCBGA surface‑mount package. It is suited for designers needing a high‑density, platform‑based FPGA with integrated memory and interface primitives for compact, commercial‑temperature designs.
Choosing this part supports scalable designs that benefit from the Avant platform’s documented building blocks (PFU blocks, sysMEM, sysDSP, clocking and SERDES/PCS), enabling developers to implement complex logic, memory interfaces and high‑speed communications while maintaining a concise bill of materials.
Request a quote or submit a pricing inquiry to receive availability and ordering information for the LAV-AT-X50-3LFG676C.