LAV-AT-X70-1LFG1156C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 554 4239360 637000 1156-BBGA, FCBGA

Quantity 320 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O554Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-X70-1LFG1156C – Avant™-X FPGA, 1156‑BBGA (35×35)

The LAV-AT-X70-1LFG1156C is an Avant™-X field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It combines a high logic capacity fabric with on-chip memory, comprehensive clocking resources, and multi-protocol I/O capability for complex programmable logic and interface tasks.

Designed for commercial-grade applications, this surface-mount 1156‑FBGA (35×35) package offers 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 554 user I/Os, delivered with a single core supply of 820 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic — 637,000 logic elements provide substantial programmable logic resources for complex designs and hardware acceleration.
  • Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) with sysMEM features such as single/dual/pseudo-dual port modes, FIFO support, RAM initialization/ROM operation, and memory cascading.
  • I/O Capacity — 554 user I/Os supporting multi-protocol interfaces and flexible sysI/O banking as described in the Avant platform architecture.
  • Clocking & Timing — Integrated clock infrastructure including on-chip oscillator, PLL, global/regional/edge clock domains, dynamic clock select/control, DLL delay and clock synchronizers for precise timing and clock distribution.
  • High-speed Interfaces & PHY — Platform-level support for SERDES, PCS, multi-protocol PHY integration and DDR memory support with DDRPHY and DQS grouping for robust high-bandwidth interface implementations.
  • Signal Processing — sysDSP blocks included in the architecture for dedicated DSP processing capabilities.
  • Device Configuration & Debug — Enhanced configuration options, JTAG support, SEU handling and trace ID facilities for configuration, verification and system reliability.
  • Package & Mounting — 1156‑BBGA (1156‑FCBGA) surface-mount package, supplier package specified as 1156‑FCBGA (35×35), suitable for high-density board layouts.
  • Commercial Grade & Compliance — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
  • Power — Core voltage supply specified at 820 mV.

Typical Applications

  • High-performance communications — Implement multi-protocol PHYs, SERDES/PCS and high-bandwidth interfaces for networking and data transport systems.
  • Memory interface controllers — Leverage sysMEM and DDRPHY support to implement DDR memory controllers, FIFOs and complex memory hierarchies.
  • Signal processing and acceleration — Use sysDSP resources and large logic fabric for compute acceleration, filtering and real-time data processing.
  • Custom I/O and protocol bridging — Deploy the extensive I/O count and programmable I/O cells to consolidate peripherals, bridge interfaces, or implement custom protocol adapters.

Unique Advantages

  • High logic density: 637,000 logic elements enable large-scale FPGA implementations without multiple devices.
  • Substantial embedded memory: Approximately 4.24 Mbits of on-chip RAM supports large buffers, FIFOs and complex state machines with flexible memory modes.
  • Extensive I/O footprint: 554 user I/Os provide the pin-count needed for multi-interface systems and dense board-level integration.
  • Comprehensive clocking and timing: On-chip oscillator, PLLs, multiple clock domains and dynamic clock control simplify timing architecture and system synchronization.
  • Advanced interface support: Built-in SERDES/PCS, multi-protocol PHY options and DDRPHY support enable high-speed link and memory subsystem implementations.
  • Compact, surface-mount package: 1156‑FCBGA (35×35) package offers a high-pin-count solution in a compact footprint for PCB space-constrained applications.

Why Choose LAV-AT-X70-1LFG1156C?

The LAV-AT-X70-1LFG1156C positions the Avant™-X platform’s capabilities into a commercial-grade FPGA offering that balances large-scale logic, embedded memory and high I/O density in a single 1156‑FBGA package. Its on-chip sysMEM, sysDSP, flexible clocking and comprehensive interface support make it suited for designs that require integrated memory handling, protocol bridging and high-speed link implementation.

This device is appropriate for system designers and engineers developing advanced communications, memory subsystem, and signal processing applications who need scalable FPGA resources, platform-level features, and vendor-provided architecture elements documented in the Avant platform overview.

Request a quote or submit an inquiry for pricing and availability for the LAV-AT-X70-1LFG1156C to evaluate fit for your next design.

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