LAV-AT-X70-2CSG841C
| Part Description |
Avant™-X Field Programmable Gate Array (FPGA) IC 303 4239360 637000 841-BGA, FCCSPBGA |
|---|---|
| Quantity | 186 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 841-FCCSP (15x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 841-BGA, FCCSPBGA | Number of I/O | 303 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-X70-2CSG841C – Avant™-X Field Programmable Gate Array (FPGA)
The LAV-AT-X70-2CSG841C is an Avant™-X FPGA IC from Lattice Semiconductor Corporation designed for high-density programmable logic integration. It provides a large logic fabric, substantial embedded memory, and abundant I/O in a compact 841-FCCSP (15×13) surface-mount package for commercial-grade applications.
Specifications include 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 303 I/O pins. The device is specified for a supply voltage of 820 mV (820 mV to 820 mV) and an operating temperature range of 0°C to 85°C. The Avant platform datasheet documents on-chip PLLs, internal oscillators, and hardened PCIe characteristics across multiple data rates.
Key Features
- Core Logic Capacity — 637,000 logic elements provide a high-density programmable fabric suitable for complex custom logic and processing pipelines.
- Embedded Memory — Approximately 4.24 Mbits of on-chip RAM for buffering, frame storage, and fast local data access.
- Extensive I/O — 303 general-purpose I/O pins to support broad system interfacing and parallel connectivity.
- High-speed Serial and Timing Blocks — Datasheet content includes sysCLOCK PLL timing, internal oscillators, and hardened PCIe characteristics (documented for 2.5, 5, 8 and 16 Gbps rates).
- Package and Mounting — 841-BGA / FCCSPBGA package (supplier device package: 841-FCCSP, 15×13) in a surface-mount form factor for compact board-level integration.
- Power and Electrical — Specified voltage supply of 820 mV (820 mV to 820 mV) as provided in the product data.
- Commercial Grade and Compliance — Commercial temperature grade (0°C to 85°C) and RoHS compliant.
Typical Applications
- High-density programmable logic — Implement custom processing blocks and complex state machines using the device’s large logic element count.
- Memory-intensive embedded designs — Use the on-chip RAM (~4.24 Mbits) for buffering, lookup tables, and intermediate data storage.
- High-speed I/O and serial interfaces — Leverage abundant I/O and the platform’s documented hardened PCIe characteristics for connectivity and data transport subsystems.
- Compact board-level integration — The 841-FCCSP (15×13) surface-mount package enables space-constrained designs requiring high logic density.
Unique Advantages
- High logic density: 637,000 logic elements allow substantial on-chip implementation of custom logic without external ASICs or discrete gates.
- Significant on-chip memory: Approximately 4.24 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
- Robust I/O count: 303 I/O pins support versatile interfacing and parallel signal connectivity for complex systems.
- Platform-level timing and connectivity: Datasheet coverage of sysCLOCK PLLs, internal oscillators, and hardened PCIe characteristics provides designs with documented timing and high-speed serial options.
- Compact, manufacturable package: 841-FCCSP (15×13) surface-mount package enables dense board layouts while meeting commercial assembly processes.
- Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose LAV-AT-X70-2CSG841C?
The LAV-AT-X70-2CSG841C positions itself as a high-density, platform-oriented FPGA option within the Avant family from Lattice Semiconductor Corporation. Its combination of 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 303 I/O pins suits designs that require substantial on-chip logic, local memory, and flexible interfacing in a compact package.
Engineers targeting commercial-temperature applications that benefit from documented platform features—such as sysCLOCK PLLs, internal oscillators, and hardened PCIe characteristics—will find the device appropriate for integration into systems where board space, I/O density, and platform-level timing are key considerations. The product is backed by the Avant platform specifications published by Lattice Semiconductor Corporation.
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