LAV-AT-X70-2LFG1156C

The LAV-AT-X70-2LFG1156C is an Avant™-X platform FPGA from Lattice Semiconductor designed for high-density programmable logic and system integration. The device combines a large logic fabric, embedded memory, extensive I/O, and platform-level building blocks described in the Avant architecture to support complex, reconfigurable designs.

This surface-mount FCBGA device is targeted at commercial designs that require abundant logic resources, on-chip memory, and flexible I/O and clocking capabilities within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity  Approximately 637,000 logic elements to implement large-scale custom logic and control functions.
• Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (total RAM bits: 4,239,360) for data buffering, lookup tables, and storage close to logic.
• High I/O Count  554 I/O pins to support extensive parallel interfaces and multi-channel connectivity.
• Avant Platform Architecture  Built on the Avant platform with Programmable Functional Unit (PFU) blocks, routing, and slice structures described in the Avant overview to enable flexible logic implementation.
• Clocking and Timing  Platform-level clock capabilities including on-chip oscillator, PLLs, global and regional clocks, edge clocks, and dynamic clock control as documented in the Avant datasheet.
• Memory and DSP Primitives  Dedicated sysMEM blocks for single/dual port and FIFO modes and sysDSP resources for algorithm acceleration are included in the platform specification.
• High-Speed Interfaces  Platform support for DDRPHY, SERDES, and PCS blocks provides the architectural building blocks for external DDR memory interfaces and serial links as described in the datasheet.
• Package and Mounting  1156-FCBGA (35×35) package, listed as 1156-BBGA, FCBGA, with surface-mount mounting for compact board-level integration.
• Supply and Temperature  Device supply listed at 820 mV; commercial operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density I/O controllers  Use the device’s 554 I/O pins to implement controllers that require many parallel interfaces or multi-channel signal aggregation.
• Embedded memory and DSP acceleration  Leverage approximately 4.24 Mbits of on-chip RAM together with platform sysDSP resources for local buffering and compute tasks.
• DDR memory interfaces and serial links  Utilize the documented DDRPHY and SERDES/PCS building blocks for designs that integrate external DDR memory or serial connectivity.
• Complex custom logic  Deploy approximately 637,000 logic elements for state machines, protocol handling, and data-path implementation within the Avant architecture.

Unique Advantages

• High logic density: Substantial logic element count enables consolidation of multiple functions into a single device, reducing board-level BOM complexity.
• On-chip memory integration: Several megabits of embedded RAM allow designers to keep data close to compute, lowering latency and simplifying memory hierarchy.
• Extensive I/O capability: 554 I/O pins provide flexibility for broad signal interfacing without external multiplexing logic.
• Platform-level primitives: Built-in clocking, memory, DSP, DDRPHY, and SERDES/PCS blocks from the Avant platform expedite integration of common system functions.
• Compact package: 1156-FCBGA (35×35) surface-mount package supports dense system designs while maintaining a commercial temperature profile.
• RoHS compliant: Environmentally compliant manufacturing footprint for applicable commercial deployments.

Why Choose LAV-AT-X70-2LFG1156C?

The LAV-AT-X70-2LFG1156C positions itself as a high-capacity, platform-oriented FPGA for commercial designs that demand significant logic resources, multiple megabits of embedded memory, and a large number of I/O. Its Avant platform architecture—featuring PFU blocks, advanced clocking, sysMEM, sysDSP, DDRPHY, and SERDES/PCS primitives—provides a structured foundation for implementing complex system functions on a single device.

This device is well suited for engineering teams needing to consolidate functions, implement high-density I/O schemes, or accelerate data-paths with on-chip memory and DSP resources while operating within a commercial temperature range and compact FCBGA package.

Request a quote or submit an inquiry today to check availability and pricing for LAV-AT-X70-2LFG1156C.