LAV-AT-X70-1LFG676I

The LAV-AT-X70-1LFG676I is an Avant™-X FPGA offering a high logic-density programmable fabric with integrated memory and extensive I/O. It is built on the Lattice Avant platform architecture and targets designs that require significant logic resources, embedded RAM, and flexible I/O in a 676-ball FCBGA package.

This device is specified for industrial-grade operation and supports a wide operating temperature range and RoHS compliance, making it suitable for applications where prolonged environmental stability and regulatory compliance are required.

Key Features

• Logic Capacity — 637,000 logic elements to implement large-scale programmable logic and custom hardware functions.
• Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) for data buffering, state storage, and memory-mapped designs.
• Extensive I/O — 298 user I/Os to support dense interfacing, multiple peripherals, and high-pin-count board designs.
• Avant Platform Architecture — Includes architecture elements described in the Avant platform overview such as programmable functional unit (PFU) blocks, routing, and programmable I/O cells for flexible design implementation.
• Clocking and Timing — Platform-level clocking features referenced in the datasheet include on-chip oscillator, PLL, global and regional clock domains, and dynamic clock control for adaptable timing architectures.
• Memory and DSP Support — Platform documentation details sysMEM blocks with single/dual-port modes, FIFO options, and sysDSP resources for algorithm acceleration.
• High-Speed Interfaces — The Avant platform overview lists SERDES/PMA blocks, multi-protocol PCS, and DDR PHY support for designs that require high-speed serial or memory interfaces.
• Package and Mounting — 676-FCBGA (27×27) package, surface-mount mounting style in a 676-BBGA/FCBGA format for compact board integration.
• Power and Temperature — Voltage supply listed at 820 mV and operating temperature range from –40 °C to 100 °C for industrial-grade thermal environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement complex control logic, I/O aggregation, and embedded memory buffers for factory automation or motion control systems operating across –40 °C to 100 °C.
• Networking and Communications — Use the device’s logic capacity, SERDES/PMA and multi-protocol PHY capabilities for packet processing, protocol bridging, or programmable data-path functions.
• Compute Acceleration — Leverage large logic and sysDSP/sysMEM resources for hardware-accelerated algorithms, data streaming, and custom compute kernels.
• High-Density I/O Systems — 298 I/Os provide flexible interfacing for multi-channel sensor aggregation, peripheral control, or board-level subsystem integration.

Unique Advantages

• Large Programmable Fabric — 637,000 logic elements enable substantial on-chip logic integration, reducing the need for external glue logic.
• Significant On-Chip Memory — Approximately 4.24 Mbits of embedded RAM supports buffering, lookup tables, and memory-intensive functions without external memory.
• Wide Industrial Temperature Range — Specified operation from –40 °C to 100 °C addresses demanding thermal environments common in industrial applications.
• Comprehensive Platform Features — The Avant platform’s clocking, memory, DSP, DDR PHY, and SERDES building blocks provide a foundation for flexible, high-performance designs.
• Compact Ball Grid Package — 676-FCBGA (27×27) package balances pin count and board footprint for dense system designs.
• Regulatory Compliance — RoHS compliance simplifies environmental regulatory considerations for product development.

Why Choose LAV-AT-X70-1LFG676I?

The LAV-AT-X70-1LFG676I combines substantial logic capacity, sizable embedded RAM, and a nearly 300-pin I/O count within a compact 676-FCBGA package, delivering a programmable solution appropriate for complex industrial and communications designs. Its specification on the Avant platform means designers can leverage documented platform features—clocking options, sysMEM, sysDSP, DDR PHY, and SERDES—to implement tailored hardware functions with predictable building blocks.

This device is well suited to engineering teams that need a scalable FPGA resource aligned with the Avant platform capabilities and require industrial-temperature operation and RoHS compliance. Its combination of logic density, memory, and I/O gives designers headroom for system integration and future feature expansion.

Request a quote or submit an inquiry to receive pricing and availability information for LAV-AT-X70-1LFG676I and to discuss how it can fit into your next design.