LAV-AT-X70-2LFG1156I

The LAV-AT-X70-2LFG1156I is an Avant™-X FPGA device from Lattice Semiconductor designed around the Avant platform architecture. The device integrates programmable functional unit (PFU) blocks, comprehensive clocking resources, on-chip memory, and high-density I/O to support complex, configurable digital logic implementations.

This industrial-grade FPGA offers a large logic fabric and substantial embedded memory, packaged in a 1156-FCBGA (35×35) surface-mount package, and is suitable for designs requiring high I/O counts and flexible on-chip resources within an operating range of −40 °C to 100 °C.

Key Features

• Logic Capacity — Contains 637,000 logic element cells, providing a substantial programmable fabric for implementing complex digital designs.
• Embedded Memory — Approximately 4.24 Mbits of total on-chip RAM (4,239,360 bits) for data buffering, FIFOs, and state storage.
• High I/O Count — 554 user I/O pins to support dense interfacing and multiple external peripherals.
• Avant Architecture Blocks — Built with PFU blocks and slices as described in the Avant platform architecture for flexible logic mapping and routing.
• Comprehensive Clocking — Includes on‑chip oscillator, PLL, Global/Regional/Edge/PHY clock domains, clock synchronizers/dividers, and dynamic clock control options.
• Memory and DSP Primitives — sysMEM blocks with single/dual/pseudo-dual port modes, FIFO support and sysDSP resources to accelerate arithmetic and data-path functions.
• High‑speed I/O and PHY Support — DDRPHY, SERDES/PMA blocks and multi-protocol PCS/PHY integration capabilities referenced in the Avant platform overview.
• Device Configuration and Reliability — Enhanced configuration options, JTAG support and SEU handling mechanisms are described in the platform documentation.
• Package & Mounting — 1156-FCBGA (35×35) supplier device package; surface-mount mounting type suitable for standard assembly flows.
• Industrial Grade & Temperature Range — Grade: Industrial; operating temperature from −40 °C to 100 °C.
• Environmental Compliance — RoHS compliant.
• Supply Voltage — Voltage supply listed as 820 mV.

Unique Advantages

• Large programmable fabric: 637,000 logic elements enable implementation of substantial custom logic and complex data-paths on a single device.
• On-chip memory for system integration: Approximately 4.24 Mbits of embedded RAM reduces external memory dependencies for many buffering and storage needs.
• Extensive I/O connectivity: 554 I/Os provide flexibility for high-pin-count interfaces and multi-channel designs.
• Advanced clocking and PHY support: Built-in PLLs, multiple clock domains, DDRPHY and SERDES/PMA building blocks support diverse timing and high-speed interface requirements.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, manufacturable package: 1156-FCBGA (35×35) surface-mount package balances pin density with standard assembly processes.

Why Choose LAV-AT-X70-2LFG1156I?

The LAV-AT-X70-2LFG1156I positions itself as a versatile Avant‑platform FPGA with a large logic element count, significant embedded memory, and a high number of user I/Os, making it well suited for complex, configurable designs that require on-chip compute and connectivity resources. The device documentation highlights the architecture’s PFU blocks, clocking topology, memory modes and PHY building blocks, enabling designers to map a wide range of digital functions onto the fabric.

With industrial-grade temperature capability, a compact 1156‑FCBGA package, and RoHS compliance, this FPGA is aimed at engineering teams needing a robust, highly configurable silicon building block. The combination of logic capacity, embedded memory resources, and extensive I/O supports scalable designs while relying on the Avant platform’s configuration and reliability features.

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