LAV-AT-X70-3CSG841I

The LAV-AT-X70-3CSG841I is an Avant™-X Field Programmable Gate Array (FPGA) from Lattice Semiconductor, designed for industrial applications that require high logic capacity and flexible I/O. This device integrates a large number of logic elements, on‑chip embedded memory, and a broad I/O complement in an 841-pin FCCSP package to support complex programmable digital designs.

Key Features

• Core Capacity — Provides 637,000 logic elements for implementing large-scale programmable logic and custom digital functions.
• Embedded Memory — Includes 4,239,360 total RAM bits, approximately 4.24 Mbits of embedded memory for buffering, state storage, and data-path implementations.
• I/O Density — 303 I/O pins to support multiple peripherals, parallel interfaces, and mixed-signal front-end connectivity.
• Package and Mounting — Supplied in an 841-BGA FCCSP package (841-FCCSP, 15×13) suitable for surface-mount PCB assembly.
• Power — Voltage supply specified at 820 mV (as provided in the product data).
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, aligning with industrial deployment requirements.
• Compliance — RoHS compliant for environmental and material compliance considerations.

Typical Applications

• Industrial Control — Use for programmable logic, protocol bridging, and real-time control tasks where extended temperature range and high logic capacity are required.
• Communications Infrastructure — Implement custom packet processing, interface aggregation, and I/O-rich front-end functions using the device’s high I/O count and logic density.
• Embedded Processing — Ideal for offloading hardware-accelerated functions or implementing custom data-paths that require substantial on-chip logic and memory resources.
• Sensor and Instrumentation Systems — Integrate signal aggregation, preprocessing, and protocol conversion in systems that operate across industrial temperature ranges.

Unique Advantages

• High Logic Density: 637,000 logic elements enable implementation of complex, large-scale programmable designs without immediate need for multiple devices.
• Substantial Embedded Memory: Approximately 4.24 Mbits of on-chip RAM supports buffering, FIFOs, and state retention for data-intensive functions.
• Rich I/O Complement: 303 I/Os allow flexible interfacing to sensors, peripherals, and high-bandwidth external devices.
• Industry-Grade Thermal Range: Rated from −40 °C to 100 °C to meet industrial environment requirements for robustness and reliability.
• Compact Package: 841-FCCSP (15×13) package balances high pin-count and compact PCB area for constrained board layouts.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and regulatory alignment.

Why Choose LAV-AT-X70-3CSG841I?

The LAV-AT-X70-3CSG841I offers a combination of high logic capacity, embedded memory, and extensive I/O in a compact FCCSP package, targeted at industrial applications that require programmable flexibility and robust operating range. Its specification set is suited for engineers building complex digital systems that demand on‑device resources and a high I/O count.

Designed to support long-term deployments, the device’s industrial temperature rating and RoHS compliance help ensure compatibility with industrial manufacturing and environmental requirements, while the large logic and memory resources provide scalability for evolving design needs.

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