LAV-AT-X70-3LFG1156I

The LAV-AT-X70-3LFG1156I is an Avant™-X field programmable gate array (FPGA) IC from Lattice Semiconductor. It implements the Avant platform architecture and provides a high logic density fabric with substantial embedded RAM and a large I/O count for complex programmable designs.

Built around Avant platform building blocks such as Programmable Functional Unit (PFU) blocks, the device targets designs that require extensive on-chip logic, embedded memory, advanced clocking and high-pin-count I/O. Key electrical and mechanical data include a single specified supply of 820 mV, industrial temperature grading from −40 °C to 100 °C, and a 1156-FCBGA (35×35) surface-mount package.

Key Features

• Core Capacity — 637,000 logic elements provide significant programmable fabric for compute, control and data-path implementations.
• Embedded Memory — Total RAM bits: 4,239,360, equivalent to approximately 4.24 Mbits of embedded memory for FIFOs, buffers and tightly coupled data storage.
• High I/O Count — 554 programmable I/O pins to support multiple external interfaces and dense board-level connectivity.
• Avant Platform Architecture — Architecture details include Programmable Functional Unit (PFU) blocks, slices and a flexible routing matrix as described in the Avant Platform overview.
• Advanced Clocking — On-chip oscillator, PLLs, global (GCLK) and regional (RCLK) clock resources, edge clocks (ECLK), PHYCLK, clock synchronizers/dividers, and dynamic clock select/control features to support complex timing domains.
• Memory and DSP Blocks — sysMEM and sysDSP building blocks support single/dual/pseudo-dual port modes, FIFO operation, memory cascading, and DSP processing as documented in the Avant Platform overview.
• Programmable I/O and DDR Support — Programmable I/O cell (PIC) structure, supported I/O standards and DDR memory support with DDRPHY and DQS grouping for external memory interfaces.
• SERDES and PHY Integration — SERDES/PMA blocks and Multi-Protocol PCS (MPPCS) and MPPHY integration options outlined in the platform datasheet for high-speed serial interfaces.
• Package & Mounting — 1156-FCBGA (35×35) package; surface-mount mounting type suitable for standard SMT assembly.
• Operating Range & Compliance — Industrial temperature range: −40 °C to 100 °C; RoHS compliant.
• Supply Voltage — Specified supply: 820 mV (documented value).

Typical Applications

• High-density logic implementations — Designs that require substantial on-chip programmable resources and embedded memory can leverage the device’s 637,000 logic elements and ~4.24 Mbits RAM.
• Large I/O and multi-interface systems — Systems that need many external interfaces or parallel buses can use the device’s 554 I/O pins for direct board-level connectivity.
• Memory interface designs — Applications requiring DDR memory integration can utilize the device’s DDRPHY support and DQS grouping capabilities described in the platform documentation.
• High-speed serial and protocol bridging — Designs using SERDES/PMA and Multi-Protocol PCS/PHY blocks benefit from the integrated serial PHY capabilities described in the Avant Platform overview.

Unique Advantages

• High logic density: 637,000 logic elements enable complex logic consolidation on a single device, reducing external glue logic.
• Substantial on-chip RAM: Approximately 4.24 Mbits of embedded memory supports deep buffering, FIFOs and tightly coupled data storage without heavy external memory reliance.
• Large, flexible I/O count: 554 I/Os provide board-level flexibility for multi-interface and high-pin-count designs.
• Comprehensive clocking and timing resources: Built-in oscillator, PLLs and multiple clock domains enable precise multi-domain timing control within the device fabric.
• Integrated PHY capabilities: SERDES/PMA and DDRPHY support simplify high-speed serial and memory interface implementation when those features are required by the design.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation and supplied in a surface-mount 1156-FCBGA package for robust board integration.

Why Choose LAV-AT-X70-3LFG1156I?

The LAV-AT-X70-3LFG1156I combines the Avant platform’s programmable architecture with a large logic fabric, significant embedded RAM and a high pin count to address demanding programmable logic tasks. Its documented platform features—PFU blocks, sysMEM, sysDSP, advanced clocking and integrated PHY/SERDES capabilities—provide a comprehensive foundation for complex FPGA-based designs.

This device is suited for teams and projects needing a high-density, industrial-grade FPGA with extensive on-chip memory and I/O capability. Its package, operating temperature range and RoHS compliance support integration into a range of industrial applications where those documented attributes are required.

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