LAV-AT-X70-3LFG1156C

The LAV-AT-X70-3LFG1156C is a commercial-grade Avant™-X FPGA from Lattice Semiconductor Corporation. It implements a high-density programmable fabric with on-chip memory and an extensive I/O complement intended for commercial embedded and communications-oriented designs.

Architected around the Avant platform, the device includes programmable functional unit blocks, a comprehensive clocking structure, memory and DSP resources, and PHY/serdes capabilities described in the Avant platform documentation. It is supplied in a 1156-ball FCBGA (35 × 35 mm) surface-mount package and is RoHS compliant.

Key Features

• Logic Fabric 637,000 logic element cells provide high logic density for complex programmable designs, as defined by the device specifications and Avant platform architecture.
• Embedded Memory Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) with sysMEM capabilities including single/dual/pseudo-dual port modes, FIFO modes, memory initialization and cascading as described in the Avant platform documentation.
• I/O Capacity and Programmable I/O 554 I/O pins with Avant platform programmable I/O cells (PIC) and sysI/O banking features to support a broad set of I/O requirements and standards referenced in the platform overview.
• Clocking and Timing Comprehensive clocking architecture documented for the Avant platform including on-chip oscillator, PLL, global/regional/edge clocks, PHYCLK, clock synchronizers/dividers, dynamic clock select/control and DLL delay features.
• Memory and PHY Support DDR memory support with DDRPHY features and DQS grouping described in the platform overview to enable high-bandwidth memory interfaces.
• SERDES and PCS SERDES/PMA blocks, Multi-Protocol PCS and MPPHY integration are part of the Avant platform capabilities for serial communication protocols and high-speed link implementations.
• Programmable DSP sysDSP resources are included in the Avant platform architecture for arithmetic and signal processing functions (details outlined in platform documentation).
• Configuration and System Features Device configuration features covered in the datasheet include enhanced configuration options, JTAG, SEU handling and trace ID facilities.
• Package and Mechanical 1156‑BBGA FCBGA package (supplier package: 1156‑FCBGA, 35 × 35 mm) designed for surface-mount assembly.
• Electrical and Environmental Voltage supply specified at 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Commercial communications equipment — Implement protocol processing, SERDES-based links and multi-protocol PHY integration using the device’s SERDES/PCS and PHY capabilities.
• High-bandwidth memory interfaces — Leverage DDRPHY and DQS grouping support for DDR memory interfacing in systems requiring on-board memory buffering and high throughput.
• Embedded processing and acceleration — Use the combination of 637,000 logic elements and sysDSP resources for custom acceleration and complex control logic in commercial embedded systems.
• High I/O count systems — Apply the 554 I/O pins and programmable I/O cell features for designs that require extensive peripheral connectivity and flexible I/O standards.

Unique Advantages

• High-density logic capacity: 637,000 logic element cells enable complex logic integration on a single device, reducing the need for multiple FPGAs.
• Substantial embedded memory: Approximately 4.24 Mbits of on-chip RAM with sysMEM features supports local buffering, FIFOs and multi-port memory configurations.
• Extensive I/O flexibility: 554 I/Os combined with programmable I/O cells and a banking scheme provide wide interfacing options for varied signal standards.
• Comprehensive clocking architecture: On-chip oscillator, PLLs and multiple clock domains support flexible timing architectures and dynamic clock control for complex systems.
• PHY and SERDES integration: DDRPHY support plus SERDES/PMA and Multi-Protocol PCS/PHY capabilities enable high-speed serial and memory interfaces without additional external PHY devices.
• Compact, manufacturable package: 1156‑FCBGA (35 × 35 mm) surface-mount package simplifies PCB layout for dense designs while meeting RoHS requirements.

Why Choose LAV-AT-X70-3LFG1156C?

The LAV-AT-X70-3LFG1156C positions the Avant™-X platform in a commercial FPGA offering that combines significant logic density, multi-megabit embedded memory, and a broad set of platform-level features including advanced clocking, DDRPHY and SERDES/PCS capabilities. These attributes make it suitable for designers who need high integration and flexible I/O in commercial embedded and communications applications.

Designers can rely on the Avant platform documentation for detailed architecture and feature descriptions to support system-level integration, configuration and timing planning. The device’s packaging, operating range and RoHS compliance align it with standard commercial manufacturing and assembly flows.

Request a quote or submit your procurement inquiry for the LAV-AT-X70-3LFG1156C to receive pricing and availability information.