LAV-AT-X70-2LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-X Field Programmable Gate Array (FPGA) IC 298 4239360 637000 676-BBGA, FCBGA

Quantity 1,600 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-X70-2LFG676I – Avant™-X FPGA, 637000 logic elements, 676-FCBGA

The LAV-AT-X70-2LFG676I is an Avant™-X Field Programmable Gate Array (FPGA) in a 676-FCBGA (27×27) package designed for industrial applications. The device integrates a high logic element count and substantial on-chip RAM alongside a wide I/O complement and an advanced platform architecture described in the Avant platform overview.

Architecturally, the device includes programmable functional unit blocks, dedicated memory and DSP subsystems, and a comprehensive clocking and I/O architecture—features that support designs requiring dense logic, flexible I/O, and embedded memory resources.

Key Features

  • Logic Capacity  Approximately 637,000 logic elements for implementing large-scale combinational and sequential logic.
  • Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) for data buffering, FIFOs, and local storage.
  • I/O Resources  298 I/O pins combined with a programmable I/O cell architecture and support for multiple I/O standards as described in the Avant platform.
  • Programmable Architecture  Supports Programmable Functional Unit (PFU) blocks and slices, offering a flexible fabric and routing structure for a wide range of logic implementations.
  • Clocking and Timing  On-chip oscillator, PLLs, global and regional clock domains, dynamic clock select/control, and DLL delay control for robust clocking and timing management.
  • Memory and DSP Subsystems  sysMEM features including single/dual/pseudo-dual port modes, RAM initialization, cascading, FIFO modes, and a sysDSP block for arithmetic and signal processing tasks.
  • High-Speed Interfaces  SERDES/PMA block, multi-protocol PCS and multi-protocol PHY integration, and DDR memory support including a DDRPHY and DQS grouping for external memory interfaces.
  • Configuration and Reliability  Enhanced configuration options, JTAG support, SEU handling provisions, and trace ID support as documented in the Avant platform overview.
  • Package & Mounting  676-FCBGA (27×27), surface-mount package designed for board-level integration; RoHS compliant.
  • Operating Range  Industrial operating temperature range of −40°C to 100°C and a nominal supply voltage of 820 mV.

Typical Applications

  • High-density logic systems  Implement complex state machines, protocol handlers, and system control logic using the device’s large logic element count and flexible fabric.
  • Memory-intensive processing  Leverage approximately 4.24 Mbits of embedded RAM and sysDSP resources for buffering, packet processing, and local data manipulation.
  • High-speed interfaces and memory subsystems  Use SERDES, DDRPHY, and multi-protocol PHY/PCS support for external memory interfaces and high-speed serial links.
  • Industrial embedded systems  Deploy in industrial environments that require an operating range of −40°C to 100°C and surface-mount integration.

Unique Advantages

  • High Logic Density:  Approximately 637,000 logic elements enable large-scale integration on a single device, reducing external logic count.
  • Significant On‑Chip Memory:  Approximately 4.24 Mbits of embedded RAM supports FIFOs, buffering, and memory-intensive functions without immediate reliance on external RAM.
  • Extensive I/O Capability:  298 I/O pins and a programmable I/O cell architecture provide flexible interfacing options for multiple standards and board-level connectivity.
  • Advanced Clocking and Timing:  Comprehensive clocking resources—including PLLs, on‑chip oscillator, and dynamic clock control—help implement complex timing domains and low-latency designs.
  • Integrated High-Speed PHYs:  SERDES/PMA, multi-protocol PCS/PHY, and DDRPHY support enable advanced serial and memory interfaces within the same device platform.
  • Industrial Qualification and Compliance:  Industrial temperature rating (−40°C to 100°C) and RoHS compliance for deployment in industrial systems.

Why Choose LAV-AT-X70-2LFG676I?

The LAV-AT-X70-2LFG676I positions itself as a high-capacity, feature-rich FPGA solution for industrial designs that require substantial logic, embedded memory, broad I/O, and advanced interface support. The Avant platform architecture documented for this device provides programmable functional units, dedicated memory and DSP resources, and comprehensive clocking and PHY options to support complex system designs.

This device is suited to engineers and system designers building memory-intensive processing elements, high-speed interface controllers, or dense logic implementations that benefit from integrated SERDES and DDR support, industrial operating range, and a high pin-count FCBGA package.

Request a quote or submit a pricing inquiry to get availability and lead-time information for LAV-AT-X70-2LFG676I.

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