LAV-AT-X70-2LFG676C

The LAV-AT-X70-2LFG676C is a field programmable gate array (FPGA) device from Lattice Semiconductor’s Avant™ platform. It combines a high logic element count with substantial on-chip memory and a large I/O complement, packaged in a 676-ball FCBGA for surface-mount applications.

Built on the Avant architecture, the device is targeted at commercial embedded designs that require programmable logic, memory interfacing and high-density I/O. Key platform capabilities described in the product documentation include programmable functional units, on-chip clocking and PLLs, sysMEM and sysDSP resources, DDR memory support and SERDES/PCS blocks.

Key Features

• Core Capacity  Provides 637000 logic element cells for programmable logic implementation and complex designs.
• Embedded Memory  Approximately 4.24 Mbits (4,239,360 bits) of on-chip RAM for local buffers, FIFOs and storage.
• I/O  298 available I/Os to support wide parallel interfaces, multiple peripheral connections and board-level routing flexibility.
• Clocking and Timing  Documented Avant platform clocking features include on-chip oscillator, PLLs, global and regional clocks, dynamic clock control and DLL delay options for flexible timing architectures.
• Memory and DSP  sysMEM memory blocks with single/dual/pseudo-dual port modes, FIFO support and RAM initialization options, plus sysDSP resources for algorithm acceleration as described in the platform overview.
• High-speed Interfaces  Platform-level support for SERDES and PCS blocks and DDR memory interfaces (including DDRPHY and DQS grouping) to enable high-bandwidth external memory and serial links.
• Configuration and Reliability  Device configuration options include JTAG and enhanced configuration modes; the datasheet also documents SEU handling considerations and trace ID features.
• Package and Mounting  676-ball FCBGA (676-FCBGA, 27×27) package, surface-mount mounting type suited for compact board designs.
• Power and Environmental  Documented voltage supply value of 820 mV and a commercial operating temperature range of 0°C to 85°C. RoHS compliant.

Typical Applications

• Communications and Networking  Implement protocol bridging, high-speed serial links and custom packet processing using SERDES/PCS blocks and abundant logic.
• Memory Interfaces and Controllers  Design DDR interfaces and memory controllers leveraging sysMEM blocks and DDRPHY support for external memory integration.
• Data Processing and Acceleration  Offload compute kernels and signal processing tasks to sysDSP resources and embedded RAM for low-latency buffering.
• Custom Embedded Systems  Serve as programmable glue logic, I/O aggregation and control in commercial embedded products requiring flexible I/O and significant logic density.
• Prototyping and Platform Integration  Use as a platform-class FPGA for validating SoC peripherals, clocking schemes and high-density logic partitioning described by the Avant architecture.

Unique Advantages

• High logic density: 637000 logic element cells enable complex, large-scale programmable designs without multiple devices.
• Substantial on-chip RAM: Approximately 4.24 Mbits of embedded memory reduces external RAM dependency for many buffering and storage use cases.
• Large I/O complement: 298 I/Os support broad connectivity options and parallel interfaces, simplifying board-level routing and system integration.
• Platform-level integration: Avant platform capabilities such as PLLs, on-chip oscillator, sysMEM, sysDSP, DDRPHY and SERDES/PCS provide a cohesive feature set for diverse embedded tasks.
• Compact surface-mount package: The 676-FCBGA (27×27) package offers a high-pin-count solution in a surface-mount form factor for dense board designs.
• Commercial-grade operating range: Rated for 0°C to 85°C with RoHS compliance for standard commercial product deployments.

Why Choose LAV-AT-X70-2LFG676C?

The LAV-AT-X70-2LFG676C is positioned for commercial designers who need high logic capacity, meaningful embedded memory and a large I/O footprint in a single FPGA package. Its integration of Avant platform features—clocking resources, sysMEM and sysDSP blocks, DDRPHY and SERDES/PCS—makes it suitable for applications requiring flexible timing, memory interfacing and high-speed connectivity.

For teams building commercial embedded systems, communications modules or prototype platforms, this device offers a balance of density, I/O capability and platform-level features that support scalable designs. The device is documented as part of the Lattice Avant platform overview for integration and implementation reference.

Request a quote or submit an RFQ to obtain pricing and availability for the LAV-AT-X70-2LFG676C.