LAV-AT-X70-3LFG676C

The LAV-AT-X70-3LFG676C is an Avant™-X series FPGA IC offering a high logic density and significant on-chip memory in a 676-FCBGA package. Built on the Lattice Avant platform, the device provides a comprehensive FPGA architecture with programmable functional units, on-chip memory, and extensive I/O capability.

This commercial-grade device is targeted at designs that require large logic capacity, substantial embedded RAM, and high I/O counts while operating within standard commercial temperature and supply ranges.

Key Features

• High Logic Density — 637,000 logic element cells to support complex digital designs and large-scale logic integration.
• Embedded Memory — 4,239,360 total RAM bits (approximately 4.24 Mbits) for on-chip data buffering, state storage, and memory-intensive functions.
• Extensive I/O — 298 user I/Os to enable wide external connectivity and multiple peripheral interfaces.
• Packaging and Mounting — 676-BBGA (676-FCBGA, 27×27) surface-mount package for dense board-level integration.
• Voltage and Temperature — Specified voltage supply range of 820 mV and operating temperature range of 0 °C to 85 °C (commercial grade).
• Platform Architecture — Avant platform architecture features documented in the series datasheet, including programmable functional unit blocks, advanced routing, clocking structures (on‑chip oscillator, PLL, global and regional clocks), and device configuration options.
• Memory and DSP Subsystems — Platform-level sysMEM and sysDSP building blocks described in the datasheet enable flexible memory modes (single/dual/pseudo-dual port, FIFO) and DSP-centric compute resources.
• Programmable I/O and High‑Speed Interfaces — The Avant platform includes programmable I/O cell capabilities, DDR memory PHY support, and SERDES/PCS building blocks as described in the platform documentation.
• Compliance — RoHS compliant.

Typical Applications

• Multi‑interface Bridges — Use abundant I/O and programmable I/O cells to implement protocol bridging and interface aggregation within constrained board space.
• Memory Controllers and Interfaces — Leverage on-chip sysMEM blocks and DDRPHY support from the Avant platform for embedded memory interfacing and buffering.
• High‑Density Logic Integration — Deploy the large logic element count to consolidate multiple functions or hardware accelerators into a single FPGA footprint.
• Custom Signal Processing — Utilize sysDSP resources and embedded RAM for data path processing, filtering, and pipeline buffering.

Unique Advantages

• Large On‑Chip Resources: 637,000 logic element cells combined with approximately 4.24 Mbits of embedded RAM reduce reliance on external components for many designs.
• High I/O Count: 298 I/Os provide flexibility for complex connectivity needs without immediate external multiplexing.
• Compact, Industry‑Standard Package: The 676-FCBGA (27×27) package allows for high-density board integration while supporting surface-mount assembly.
• Platform Capabilities: Built on the Avant platform with documented features such as programmable functional units, clock management (PLL, GCLK/RCLK), and SERDES/PCS blocks to support a wide range of digital architectures.
• Commercial Temperature Grade: Specified for 0 °C to 85 °C operation to align with commercial environment requirements.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing standards for many production programs.

Why Choose LAV-AT-X70-3LFG676C?

The LAV-AT-X70-3LFG676C packages substantial FPGA resources—high logic element count, multi‑Mbit embedded RAM, and nearly 300 I/Os—into a single 676‑FCBGA surface‑mount device based on the Avant platform. It is suited to designers who need to consolidate complex digital functions, implement on‑chip memory-heavy algorithms, or support multiple high‑pin interfaces while maintaining a commercial temperature profile.

Choosing this part provides access to the Avant platform feature set documented in the series datasheet—programmable functional units, flexible memory modes, clocking and PLL options, DDRPHY and SERDES/PCS building blocks—enabling scalable implementation choices and design reuse across projects that target advanced FPGA capabilities.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for LAV-AT-X70-3LFG676C. Our team can provide further technical and purchasing assistance to support your design and procurement process.