LAXP2-17E-5QN208E

The LAXP2-17E-5QN208E is an LA-LatticeXP2 family FPGA with a flexiFLASH architecture, combining a LUT-based programmable fabric with on-chip non-volatile flash. Designed for embedded and automotive applications, the device delivers reconfigurable logic, dedicated DSP resources and a flexible I/O set in a 208-pin PQFP package.

This part targets designs that require instant-on reconfigurability, secure field updates and robust operation across a wide temperature range, while keeping board-level integration compact with surface-mount 208-BFQFP packaging.

Key Features

• Core Architecture – flexiFLASH Instant-on single-chip architecture with non-volatile flash-based configuration, FlashBAK embedded block memory and Serial TAG memory for design security and reconfigurability.
• Automotive Qualification AEC-Q100 tested and qualified with a specified operating temperature range of -40°C to 125°C, supporting automotive-grade reliability requirements.
• Logic Capacity 17,000 logic elements (LUT-based fabric) suitable for mid-density programmable logic implementations.
• DSP and Multipliers sysDSP architecture with five sysDSP blocks and support for up to twenty 18 × 18 multipliers for high-performance multiply–accumulate operations.
• Embedded Memory Total on-chip RAM of 282,624 bits for embedded SRAM and distributed RAM to support buffering, state storage and intermediate data.
• I/O and Interface Support 146 available I/Os in the 208-PQFP (28 × 28 mm) package and flexible sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS signaling (per family features).
• Live Update and Security Live Update technology with TransFR, dual-boot capability and secure updates protected by 128-bit AES encryption (family-level features).
• Power and Packaging Low-voltage operation with supply range 1.14 V to 1.26 V, surface-mount 208-BFQFP (208-PQFP, 28 × 28 mm) package, RoHS compliant.

Typical Applications

• Automotive Control Systems AEC-Q100 qualification and extended temperature range make this device suitable for vehicle electronics that require reconfigurable logic and robust operation.
• Signal Processing and Motor Control sysDSP blocks and multiple 18 × 18 multipliers support real-time multiply–accumulate workloads for sensor processing and motor drive algorithms.
• Secure Field Updates Dual-boot and secure TransFR firmware update capabilities with 128-bit AES encryption enable secure in-system updates.
• User Interfaces and Display Interfaces Flexible I/O standards and pre-engineered source-synchronous interfaces support display and human–machine interface implementations.

Unique Advantages

• Automotive-Grade Reliability: AEC-Q100 qualification combined with a -40°C to 125°C operating range supports demanding vehicle environments.
• Instant-On Non-Volatile Configuration: flash-based flexiFLASH architecture eliminates external configuration memory for faster system startup and simpler BOM.
• Integrated DSP Resources: Five sysDSP blocks and up to twenty 18 × 18 multipliers accelerate math-intensive workloads without external accelerators.
• Secure Live Updates: TransFR live update technology and 128-bit AES encryption enable field updates with integrity and rollback options (dual-boot).
• Flexible I/O in Compact Package: 146 I/Os in a 208-PQFP surface-mount package support diverse signaling standards while keeping board area predictable.
• Compact Embedded Memory: Approximately 282,624 bits of on-chip RAM provide local storage for buffering and state retention within the FPGA fabric.

Why Choose LAXP2-17E-5QN208E?

The LAXP2-17E-5QN208E positions mid-density programmable logic with automotive qualification and a rich feature set—combining reconfigurable flash-based configuration, integrated DSP resources and flexible I/O in a single surface-mount package. It is suited for engineers building automotive and embedded systems that require secure updates, deterministic performance for signal processing tasks, and operation across extended temperatures.

Choosing this FPGA enables lower board-level complexity through on-chip non-volatile configuration and integrated memory/DSP resources, while leveraging family-level features such as Live Update and flexible interface support for scalable system designs.

Request a quote or contact sales to discuss availability, lead times and pricing for LAXP2-17E-5QN208E.