LAXP2-5E-5QN208E
| Part Description |
LA-XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP |
|---|---|
| Quantity | 1,393 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 625 | Number of Logic Elements/Cells | 5000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 169984 |
Overview of LAXP2-5E-5QN208E – LA-XP2 Field Programmable Gate Array (FPGA) IC 146 169984 5000 208-BFQFP
The LAXP2-5E-5QN208E is a LA-LatticeXP2 family FPGA that combines a LUT-based FPGA fabric with non-volatile flash in a flexiFLASH architecture. This device targets embedded and automotive applications that require reconfigurable logic, on-chip flash configuration, and secure firmware update capability.
With 5,000 logic elements, approximately 170 kbits of on-chip RAM and 146 I/Os in a 208-pin PQFP package, the device delivers a compact, automotive-grade programmable solution qualified to AEC-Q100 and rated for operation from −40 °C to 125 °C.
Key Features
- Core Logic — 5,000 logic elements providing LUT-based FPGA fabric for custom logic implementation and flexible hardware acceleration.
- Embedded Memory — Total on-chip RAM of 169,984 bits (approximately 170 kbits) for embedded storage and buffering needs.
- sysDSP and Multipliers — Includes three sysDSP blocks and twelve 18×18 multipliers (family LA-XP2-5 specification) to accelerate multiply-and-accumulate and signal-processing tasks.
- Flexible I/O — 146 I/Os in the 208-BFQFP package with support for a wide range of standards detailed in the LA-LatticeXP2 family (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, MLVDS, LVPECL, RSDS and source-synchronous interfaces).
- Configuration & Security — flexiFLASH architecture with instant-on, FlashBAK block memory and Serial TAG memory; Live Update support including TransFR technology, dual-boot with external SPI and 128-bit AES encryption for secure updates.
- Clocking — Integrated sysCLOCK PLLs (family supports up to four analog PLLs) for clock multiply/divide and phase shifting to support precise timing and source-synchronous interfaces.
- Power & Voltage — Low-voltage operation with supply range from 1.14 V to 1.26 V.
- Package & Mounting — 208-pin PQFP (208-BFQFP, 28×28 mm) surface-mount package suitable for space-constrained boards.
- Automotive Qualification — AEC-Q100 tested and qualified and specified for operation from −40 °C to 125 °C.
Typical Applications
- Automotive control systems — Reconfigurable logic and on-chip flash enable in-vehicle control, sensor interfacing and subsystem customization with automotive-grade qualification.
- Infotainment and display interfaces — Pre-engineered source-synchronous and LVDS interfaces support display and multimedia data paths.
- Memory and high-speed interfaces — Built-in support for DDR/DDR2 source-synchronous interfaces and PLL clocking for timing-critical memory bridging and interface logic.
- Secure field updates — Live Update and AES-encrypted update support enable secure in-field firmware management and dual-boot configurations.
Unique Advantages
- Integrated flash-based configuration: flexiFLASH architecture provides instant-on and infinitely reconfigurable single-chip operation without external configuration PROMs.
- Automotive-ready reliability: AEC-Q100 qualification and −40 °C to 125 °C operating range support deployment in automotive environments.
- On-board DSP acceleration: Three sysDSP blocks and dedicated 18×18 multipliers accelerate signal-processing functions, reducing external component count.
- Secure update capability: TransFR Live Update and 128-bit AES encryption enable secure, controlled firmware updates and dual-boot strategies for high-availability systems.
- Compact package with abundant I/O: 146 I/Os in a 208-pin PQFP deliver extensive I/O connectivity in a compact surface-mount form factor.
- Low-voltage operation: Narrow supply window (1.14–1.26 V) enables consistent power-domain design and compatibility with 1.2 V system rails.
Why Choose LAXP2-5E-5QN208E?
The LAXP2-5E-5QN208E balances reconfigurable logic capacity, on-chip embedded memory and DSP resources in an automotive-qualified FPGA package. Its flexiFLASH architecture, secure Live Update features and integrated DSP/multiplier resources make it a solid choice for embedded and automotive designers who need field-updateable hardware, signal-processing acceleration and a compact 208-pin PQFP footprint.
Backed by the LA-LatticeXP2 family feature set and design tool support referenced in the family datasheet, this device is positioned for applications that require long-term robustness, secure update paths and a blend of logic, memory and high-speed I/O in an AEC-Q100 qualified part.
Request a quote or submit an inquiry to check pricing and availability for the LAXP2-5E-5QN208E and to discuss configuration, lead times and volume options.

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