LAXP2-8E-5FTN256E

The LAXP2-8E-5FTN256E is a LA-LatticeXP2 family FPGA combining a LUT-based logic fabric with on-chip non-volatile flash configuration in a flexiFLASH architecture. This AEC-Q100–qualified device targets automotive-grade embedded applications that require reconfigurability, on-chip memory and robust I/O in a compact 256-ball ftBGA package.

Designed for intelligent control, high-speed interfaces and systems requiring secure updates, the device provides a balance of logic capacity, embedded memory and DSP resources while operating over a 1.14 V to 1.26 V supply and an extended temperature range of −40 °C to 125 °C.

Key Features

• Core Architecture — flexiFLASH Instant-on, single-chip flash-based configuration with on-chip FlashBAK and Serial TAG memory for reconfigurability and secure storage.
• Logic Resources Approximately 8,000 logic elements organized across 1,000 CLBs, suitable for mid-density FPGA implementations.
• Embedded Memory Total on-chip RAM: 226,304 bits (approximately 0.226 Mbits) for embedded and distributed memory requirements.
• sysDSP and Multipliers Device-level sysDSP support with four sysDSP blocks and up to sixteen 18 × 18 multipliers for high-performance multiply-accumulate operations.
• I/O and Interfaces 201 I/Os in a flexible sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS standards; pre-engineered DDR/DDR2 and 7:1 LVDS source-synchronous interfaces are supported by the family architecture.
• Configuration & Security SPI boot flash interface with dual-boot capability and secure Live Update technology, including TransFR and 128-bit AES encryption support as part of the family feature set.
• System & Clocking Up to four analog PLLs for clock multiplication, division and phase shifting; on-chip oscillator available for initialization and general use.
• Qualification & Environmental Automotive grade with AEC‑Q100 qualification and RoHS compliance; operating temperature range −40 °C to 125 °C.
• Package & Power Surface-mount 256-ball ftBGA (17 × 17 mm) package; specified supply voltage range 1.14 V to 1.26 V.

Typical Applications

• Automotive Systems — Engine control, body electronics or other in-vehicle functions that benefit from AEC‑Q100 qualification and extended temperature operation.
• Display and Imaging Interfaces — Support for 7:1 LVDS source-synchronous links and flexible I/O standards makes the device suitable for display bridging and image-data interfacing.
• Memory Interface and Bridging — Pre-engineered DDR/DDR2 interfaces and plentiful I/O allow use as memory interface logic or protocol bridging in embedded systems.
• Secure Firmware Update and Management — On-chip flash configuration plus Live Update and AES-based secure update capability for field-reprogrammable systems.

Unique Advantages

• Instant-on, non-volatile configuration: flexiFLASH architecture provides single-chip flash configuration for immediate startup and infinite reconfigurability.
• Automotive qualification: AEC‑Q100 testing supports deployment in temperature-critical automotive environments.
• Balanced compute and DSP: Combination of approximately 8,000 logic elements with multiple sysDSP blocks and 18 × 18 multipliers addresses control and signal-processing tasks without external accelerators.
• Flexible, high-density I/O: 201 I/Os with broad standard support simplifies integration with a wide range of peripherals and high-speed interfaces.
• Compact, surface-mount package: 256-ball ftBGA (17 × 17 mm) delivers a small PCB footprint for space-constrained embedded designs.
• Secure update capability: Family-level support for TransFR and 128-bit AES encryption enables controlled, authenticated firmware updates.

Why Choose LAXP2-8E-5FTN256E?

The LAXP2-8E-5FTN256E places mid-range FPGA capacity, DSP acceleration and flash-based instant-on configuration into an automotive-qualified, compact ftBGA package. Its mix of ~8,000 logic elements, on-chip RAM and flexible I/O support is suited to embedded systems that require reprogrammability, secure updates and reliable operation across −40 °C to 125 °C.

This device is well-suited for design teams building automotive electronics, display interfaces, memory bridging and secure field-update systems who need a rugged, integrated FPGA solution with proven family features such as sysDSP blocks, PLLs and wide I/O standard support.

Request a quote or submit an inquiry to get pricing and availability for LAXP2-8E-5FTN256E and support for your design requirements.