LAXP2-8E-5MN132E

The LAXP2-8E-5MN132E is a member of the LA-LatticeXP2 family of FPGAs combining a LUT-based FPGA fabric with the family’s flexiFLASH architecture for instant-on, infinitely reconfigurable single-chip designs. This device targets robust embedded systems with on-chip flash, DSP capability, and a compact 132-ball csBGA package optimized for space-constrained applications.

With 8,000 logic elements, approximately 226,304 bits of embedded RAM, AEC-Q100 qualification and an extended operating range, the device is designed for automotive and similarly demanding applications that require reliable, instant-on programmable logic, flexible I/O and secure update capability.

Key Features

• Core and Architecture LA-LatticeXP2 family flexiFLASH architecture provides instant-on operation and single-chip non-volatile configuration storage.
• Logic Capacity Approximately 8,000 logic elements suitable for mid-density programmable logic implementations.
• Embedded Memory Approximately 0.226 Mbits (226,304 bits) of total on-chip RAM for embedded and distributed memory needs.
• DSP and Arithmetic sysDSP blocks (family features) with support for multiple 18 × 18 multipliers for efficient MAC and signal-processing tasks.
• I/O Flexibility 86 I/Os in the 132-ball csBGA package, with family support for a broad set of I/O standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
• Configuration & Security flexiFLASH with FlashBAK, serial TAG memory and Live Update technology (TransFR). Supports secure updates with 128-bit AES encryption and dual-boot with external SPI (family-level features).
• Power and Supply Nominal device operating supply range of 1.14 V to 1.26 V.
• Package & Mounting 132-LFBGA / CSPBGA (132-CSBGA, 8 × 8 mm) in a surface-mount format for compact board-level integration.
• Automotive Qualification & Temperature AEC-Q100 tested and qualified with an operating temperature range of −40 °C to 125 °C.

Typical Applications

• Automotive Control and Sensor Processing — Mid-density programmable logic for sensor interfacing, control algorithms and on-board data handling in vehicle systems, leveraging AEC-Q100 qualification and extended temperature range.
• Infotainment and Display Interfaces — I/O flexibility and family-level pre-engineered source-synchronous interfaces (including LVDS display support) for display timing, bridging and video interface tasks.
• Secure Embedded Systems — Instant-on, on-chip non-volatile configuration and secure update features make the device suitable for embedded systems requiring field updates and design security.
• Signal Processing and Aggregation — sysDSP blocks and multiple 18×18 multipliers accelerate multiply-and-accumulate workloads for filtering, basic signal processing and data aggregation.

Unique Advantages

• Instant-on, Non-Volatile Architecture: flexiFLASH provides single-chip configuration storage and immediate startup without external configuration devices.
• Automotive-Grade Reliability: AEC-Q100 qualification and a −40 °C to 125 °C operating range support deployment in temperature-stressed environments.
• Integrated DSP Capability: sysDSP blocks and multiple 18×18 multipliers enable on-chip signal-processing functions, reducing the need for external DSP components.
• Secure Field Updates: Live Update (TransFR) with 128-bit AES encryption and dual-boot support enables secure remote firmware updates and rollbacks.
• Compact, Board-Friendly Package: 132-ball csBGA (8 × 8 mm) surface-mount package balances I/O count and PCB area for space-constrained designs.

Why Choose LAXP2-8E-5MN132E?

The LAXP2-8E-5MN132E brings together mid-range logic capacity, on-chip non-volatile configuration, embedded RAM and DSP capability in a compact, automotive-qualified package. It is well suited for designers who need a reliable, reconfigurable solution that supports secure updates and operates across an extended temperature range.

This device fits designs that require a balance of programmable logic, memory and DSP resources while maintaining automotive qualification and board-level compactness. Its family-level ecosystem and configuration features provide a pathway for scalable designs and controlled field updates over the product lifecycle.

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