LCMXO1200C-3B256C

The LCMXO1200C-3B256C is a MachXO family field programmable gate array (FPGA) in a 256-ball LFBGA/CSPBGA package, delivering 1200 logic elements and up to 211 I/Os in a single surface-mount device. The MachXO family combines non-volatile configuration with FPGA-style LUT and embedded memory architecture, making it well suited for glue logic, bus bridging, bus interfacing, power-up control and general control logic in commercial applications.

This device provides instant-on, single-chip configuration plus flexible I/O and on-chip memory, enabling compact, secure designs that reduce external component count and simplify system architecture.

Key Features

• Logic Capacity — 1200 logic elements for implementing glue logic, control state machines and low-to-mid density FPGA functions.
• I/O Density — Up to 211 I/Os to support complex interfacing and bus bridging in compact packages.
• On-chip Memory — Total on-chip RAM: 9,421 bits for distributed and embedded block RAM usage in control and buffering tasks.
• Non-volatile, Instant-on Configuration — MachXO family supports single-chip non-volatile configuration with instant-on behavior and no external configuration memory required.
• Reconfiguration and Programming — Reconfigure SRAM-based logic in milliseconds, background programming of non-volatile memory, and JTAG programmability as described by the MachXO family.
• Clocking — Includes 1 analog PLL (per MachXO1200 family specification) for clock multiply/divide and phase adjustments.
• Flexible I/O — sysIO buffer support across a broad set of interfaces (examples in family datasheet include LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS).
• Power and Voltage — Operates from 1.71 V to 3.465 V supply range; family-level features include sleep mode for substantial static current reduction.
• Package and Mounting — Surface-mount 256-LFBGA / CSPBGA (supplier package 256-CABGA, 14×14 mm) suitable for compact board layouts.
• Commercial Grade — Rated for 0 °C to 85 °C operating temperature; RoHS compliant.

Typical Applications

• Glue Logic and System Control — Replace discrete glue components with a single-chip MachXO solution for startup sequencing, reset logic, and control-state management.
• Bus Bridging and Interfacing — Use the device’s high I/O count and flexible sysIO buffers to implement protocol adaptors, bus transceivers and interface bridging.
• Power-up and Sequencing Control — Leverage instant-on non-volatile configuration for reliable power-up behavior and deterministic system initialization.
• Peripheral and I/O Aggregation — Aggregate multiple peripheral signals and implement local processing, glue logic or simple packet handling using on-chip RAM and logic resources.

Unique Advantages

• Single-chip, non-volatile solution: Eliminates the need for external configuration memory while enabling instant-on operation for faster system availability.
• High I/O to logic ratio: Up to 211 I/Os paired with 1200 logic elements enables dense interfacing without large FPGA overhead.
• In-field reconfiguration: Supports rapid SRAM reconfiguration and background non-volatile programming for flexible field updates and iterative development.
• Flexible interfacing and clocking: sysIO buffer options and a dedicated PLL provide adaptable signaling and clock management for a variety of interfaces.
• Compact packaging: 256-ball LFBGA/CSPBGA package provides high pin-count in a 14×14 mm footprint for space-constrained designs.
• Design tool support: MachXO family designs are supported by vendor design tools for synthesis, placement and timing analysis to streamline development.

Why Choose LCMXO1200C-3B256C?

The LCMXO1200C-3B256C positions itself as a compact, non-volatile FPGA solution for commercial systems requiring reliable startup behavior, flexible I/O, and moderate logic and memory resources. Its combination of 1200 logic elements, approximately 9.4 Kbits of on-chip RAM and up to 211 I/Os makes it well suited to replace discrete glue logic or integrate control and interface functions into a single device.

For designers seeking reduced BOM, secure single-chip configuration, and the ability to perform in-field updates, this MachXO family device delivers a practical balance of integration and flexibility backed by family-level features and vendor design tool support.

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