LCMXO1200C-3B256I

The LCMXO1200C-3B256I is a MachXO family field-programmable gate array (FPGA) IC optimized for glue logic, bus bridging, power-up control and general control logic. It combines non-volatile configuration with FPGA-style lookup-table architecture to deliver instant-on, reconfigurable logic in a single surface-mount package.

Designed for industrial applications, this device provides 1200 logic elements, up to 211 I/Os, embedded memory and on-chip clocking, enabling compact, low-BOM system designs that require deterministic start-up and in-field reconfiguration.

Key Features

• Core Architecture  1200 logic elements (LUT-based) for implementing glue logic, state machines and interface bridging.
• Non-volatile Instant-On  Single-chip non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
• Reconfiguration and Sleep  Supports in-field reconfiguration and background programming; includes a sleep mode for significant static current reduction.
• Embedded Memory  Approximately 9.4 Kbits of on-chip RAM (total RAM bits: 9,421) for distributed and embedded storage needs.
• I/O and Interface Flexibility  Up to 211 I/Os with programmable buffer support for common standards (LVCMOS/LVTTL and differential interfaces as supported across the MachXO family).
• Clock Management  Includes sysCLOCK PLL resources as provided within the MachXO family for clock multiply/divide and phase shifting (family table indicates support for PLLs on this device class).
• Power and Supply Range  Operates across a wide supply range from 1.71 V to 3.465 V, supporting multiple system voltage domains.
• Industrial Grade & Robust Packaging  Industrial grade device with operating temperature range of −40 °C to 100 °C, supplied in a 256-ball LFBGA/CABGA package (256-CABGA, 14×14).
• Standards & Compliance  RoHS-compliant packaging and IEEE 1149.1 boundary-scan and IEEE 1532 in-system programming support across the MachXO family as documented in the datasheet.

Typical Applications

• Glue Logic and System Control  Implement power-up sequencing, reset distribution and control-state machines to reduce external discrete logic.
• Bus Bridging and Protocol Conversion  Bridge between host buses and peripherals, handle interface adaptation and timing translation within compact PCB footprints.
• I/O Expansion and Signal Conditioning  Aggregate and re-drive I/Os for systems requiring flexible pin assignment and programmable I/O standards.
• Field Updatable Control  Enable in-field logic updates and background programming for evolving product feature sets or firmware fixes.

Unique Advantages

• Single-chip non-volatile configuration: Eliminates external configuration memory and enables microsecond-scale power-up behavior for faster system availability.
• Compact, high I/O count in a small BGA: 211 available I/Os in a 256-ball package reduce PCB area and simplify routing for dense designs.
• Industrial temperature range: −40 °C to 100 °C operation suits demanding environmental conditions without derating logic capacity.
• Flexible supply support: Broad supply range (1.71 V–3.465 V) allows use in diverse system voltage domains and mixed-voltage applications.
• On-chip memory and clocking: Built-in RAM and PLL capabilities provide localized buffering and clock management without external components.
• Background programming and reconfiguration: Supports in-system updates and background programming workflows to minimize downtime and simplify field upgrades.

Why Choose LCMXO1200C-3B256I?

The LCMXO1200C-3B256I positions itself as a practical, industrial-grade FPGA solution for engineers needing non-volatile instant-on logic, flexible I/O, and modest embedded memory in a single surface-mount package. Its combination of 1200 logic elements, approximately 9.4 Kbits of on-chip RAM, and up to 211 I/Os helps reduce component count and simplify system design for control, interfacing and I/O aggregation tasks.

Backed by the MachXO family architecture and associated design tool support, this device is well suited to development teams and procurement groups looking for a robust, reconfigurable building block that supports in-field updates and deterministic start-up behavior over a wide industrial temperature range.

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