LCMXO1200C-3FT256I

The LCMXO1200C-3FT256I is a MachXO family FPGA optimized for glue logic, bus interfacing and control functions. It combines non-volatile configuration, reconfigurable logic and flexible I/O in a single surface-mount package suitable for industrial applications.

Architected with 1,200 logic elements and up to 211 I/Os, this device targets designs that need instant-on behavior, in-field reconfiguration and a compact, low-BOM implementation while supporting a broad supply-voltage window and industrial temperature operation.

Key Features

• Core Logic — 1,200 logic elements (cells) providing the programmable fabric required for glue logic, control functions and low-capacity FPGA tasks.
• On-chip Memory — Approximately 9,421 bits of on-chip RAM and family support for embedded and distributed memory blocks for state storage and FIFO control.
• I/O Density & Flexibility — Up to 211 I/Os in the 256-ball package with a programmable sysIO™ buffer that supports a wide range of interfaces and I/O standards.
• Power & Voltage — Operates across a supply range of 1.71 V to 3.465 V; the MachXO family supports common I/O and core voltage options.
• Reconfiguration & Security — Non-volatile, single‑chip configuration with instant-on operation and in-field reconfiguration capabilities for background programming and TrnsFR™ updates.
• Clocking — Includes on-chip clock resources with one analog PLL on the LCMXO1200 device for clock multiply/divide and phase adjustments.
• Package & Mounting — Supplied in a 256-ball ftBGA package (256-LBGA footprint) suitable for surface-mount assembly (17×17 mm supplier package).
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for demanding environmental conditions.
• Compliance — RoHS compliant packaging.

Typical Applications

• Glue Logic & System Control — Implement glue logic, power-up sequencing and board-level control functions with compact, non-volatile FPGA logic.
• Bus Bridging & Interfacing — Bridge or interface between buses and peripherals using the device’s flexible I/O and programmable buffers.
• Peripheral & I/O Expansion — Create custom I/O mixes and protocol adapters leveraging up to 211 I/Os and programmable I/O standards.
• In-Field Updatable Control Logic — Perform in-system updates and background reprogramming to evolve firmware and adapt to changing system requirements.

Unique Advantages

• Non-volatile, single-chip configuration: Instant-on behavior and no external configuration memory reduce BOM and simplify system power-up.
• High I/O-to-logic ratio: 211 I/Os paired with 1,200 logic elements enables dense I/O-centric designs without excess logic overhead.
• In-field reconfiguration: Background programming and TransFR reconfiguration support live updates and iterative development in deployed systems.
• Flexible interfacing: Programmable sysIO buffers and family support for multiple interface standards simplify mixed-signal and mixed-voltage board designs.
• Industrial readiness: Industrial-grade temperature range (−40 °C to 100 °C) and surface-mount ftBGA packaging facilitate reliable deployment in harsh environments.

Why Choose LCMXO1200C-3FT256I?

The LCMXO1200C-3FT256I positions itself as a compact, non-volatile FPGA solution for engineers needing instant-on, reconfigurable logic with a strong I/O complement. Its combination of 1,200 logic elements, approximately 9,421 bits of on-chip RAM, one analog PLL and up to 211 I/Os makes it well suited for control, bridging and interface tasks where board-level integration and low BOM are priorities.

Designed for industrial temperatures and supplied in a 256-ball ftBGA surface-mount package, this MachXO device offers a balance of integration, configurability and deployment robustness backed by the MachXO family architecture.

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