LCMXO1200C-3M132I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 101 9421 1200 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 195 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 101 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-3M132I – MachXO FPGA, 1,200 logic elements, 132-LFBGA (CSPBGA)
The LCMXO1200C-3M132I is a MachXO family field programmable gate array (FPGA) in a 132-ball LFBGA (CSPBGA) package. It combines non-volatile configuration, a compact package, and a broad I/O count to address glue logic, bus bridging, power-up control and general control logic in industrial systems.
Designed for industrial-grade environments, the device provides 1,200 logic elements, 101 I/Os, and approximately 9,421 bits of on-chip RAM while supporting a wide supply voltage range and extended operating temperature for robust deployment.
Key Features
- Core Logic — 1,200 logic elements and 150 logic blocks provide the programmable resources for glue logic, interfacing, and control functions.
- Embedded Memory — Approximately 9,421 bits of on-chip RAM for small buffers, FIFOs, and distributed storage needs.
- Flexible I/O — 101 I/O pins in the 132-LFBGA package enable dense pin access. The MachXO family supports a broad set of interface standards for flexible system-level integration.
- Non‑volatile, Instant‑on — Single-chip non-volatile configuration delivers immediate start-up without external configuration memory and supports secure bitstream handling.
- In-field Reconfiguration — Family-level support for background and in-field reconfiguration allows updates and partial reprogramming while the system is operational.
- Power Management — Sleep mode capability provides significant static current reduction for low-power standby operation.
- Supply Voltage Range — Operates across a wide supply range (1.71 V to 3.465 V), enabling compatibility with multiple system voltage rails.
- Package & Mounting — Surface-mount 132-LFBGA (132-CSPBGA, 8×8 mm footprint) for compact board layouts and high pin density.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial applications.
- Compliance — RoHS-compliant packaging.
Typical Applications
- Glue Logic and System Control — Implement board-level interfacing, control sequencing, and custom logic without external configuration memories.
- Bus Bridging and Interfacing — Handle protocol adaptation and bus interfacing tasks where flexible I/O and reconfigurability are required.
- Power‑up and Reset Control — Manage power sequencing and supervisory control functions with instant-on capability.
- Embedded Control Logic — Integrate control state machines, small FIFOs, and timing logic within a single industrial-grade device.
Unique Advantages
- Single‑chip non‑volatile configuration: Eliminates the need for external configuration memory, simplifying BOM and board design.
- Instant-on operation: Powers up quickly from a configured state to minimize system boot time and improve system responsiveness.
- In-field update capability: Background and in-system programming enable field upgrades and iterative feature updates without full system downtime.
- Industrial robustness: Wide operating temperature range (−40 °C to 100 °C) and RoHS-compliant packaging support deployment in industrial environments.
- Compact, high-density package: 132-LFBGA (8×8 mm) provides a small PCB footprint while offering 101 I/Os for flexible interfacing.
- Wide supply compatibility: 1.71 V to 3.465 V supply range accommodates multiple system voltage domains.
Why Choose LCMXO1200C-3M132I?
The LCMXO1200C-3M132I positions MachXO family capabilities—non-volatile instant-on configuration, in-field reconfigurability, and flexible I/O—in a compact industrial-grade package. Its combination of 1,200 logic elements, approximately 9,421 bits of on-chip RAM, and 101 I/Os makes it suitable for designs that require reliable control, interfacing, and glue-logic functions with the option to update logic in the field.
Engineers seeking a single-chip programmable solution for industrial control, bus interfacing, or system management will find the LCMXO1200C-3M132I a practical choice where fast startup, reduced BOM, and extended temperature operation matter.
Request a quote or submit an inquiry to obtain pricing and availability for the LCMXO1200C-3M132I.

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