LCMXO1200C-3FTN256I

The LCMXO1200C-3FTN256I is a MachXO family FPGA offering a balance of non-volatile configuration, flexible I/O and compact BGA packaging for industrial-grade embedded designs. Built on the MachXO architecture, this device targets glue logic, bus interfacing and control applications where instant-on, in-field reconfiguration and reliable I/O density are important.

Key attributes include 1,200 logic elements, up to 211 I/O pins in a 256-ball BGA package, on-chip non-volatile configuration and a wide supply range to support mixed-voltage system integration.

Key Features

• Non‑volatile, instant-on configuration — Single-chip non-volatile architecture requires no external configuration memory and powers up in microseconds for fast system startup.
• In-field reconfiguration — Reconfigure SRAM-based logic in milliseconds and support background programming of non-volatile memory through JTAG; TransFR™ reconfiguration enables in-field logic updates while the system operates.
• Logic capacity — 1,200 logic elements suitable for glue logic, bus bridging and control logic implementations.
• On‑chip memory — Total on-chip RAM of approximately 9,421 bits to support embedded and distributed memory needs.
• I/O and package — Up to 211 I/Os in a 256-ball ftBGA (17×17) / 256-LBGA package; surface-mount package for compact board designs.
• Programmable I/O standards — Flexible sysIO™ buffer architecture supports a wide range of interface standards for mixed-signal systems (as documented in the MachXO family data sheet).
• Clocking — MachXO1200 family member includes PLL support for clock multiply/divide and phase shifting (1 PLL for the MachXO1200 device).
• Low‑power modes — Sleep mode enables significant static current reduction (up to 100× reduction), helping reduce standby power.
• Voltage and temperature range — Operates from 1.71 V to 3.465 V and is rated for industrial temperatures from −40 °C to 100 °C.
• Regulatory — RoHS compliant packaging.

Typical Applications

• Glue logic and system control — Implement power-up control, reset sequencing and board-level control functions with compact, non-volatile logic.
• Bus bridging and interfacing — Provide protocol translation, bus interfacing and signal conditioning using flexible I/O and dense pin count.
• Peripheral and sensor aggregation — Aggregate signals from sensors and peripherals and implement deterministic control and timing functions.
• Field-upgradeable control logic — Use TransFR reconfiguration and background programming to update in-system logic without taking the system offline.

Unique Advantages

• Single-chip non-volatile FPGA: Eliminates the need for external configuration memory and enables instant-on behavior for fast system availability.
• High I/O density in a compact package: 211 I/Os in a 256-ball BGA provide strong pin-to-function density for space-constrained designs.
• Flexible power support: Wide supply range (1.71 V–3.465 V) allows integration with multiple logic voltage domains without extra level-shifting components.
• Designed for industrial use: Rated for −40 °C to 100 °C and supplied in RoHS-compliant surface-mount packaging for robust deployment.
• Low-power standby: Sleep mode capability offers substantial static current reduction for energy-conscious designs.
• In-field update capability: TransFR and JTAG-programmable non-volatile memory simplify maintenance and extend product lifecycle through remote updates.

Why Choose LCMXO1200C-3FTN256I?

The LCMXO1200C-3FTN256I positions itself as a compact, industrial-grade MachXO FPGA for applications that require instant-on non-volatile configuration, flexible I/O and in-field reprogrammability. With 1,200 logic elements, approximately 9.4 Kbits of on-chip RAM, and up to 211 I/Os in a 256-ball BGA, it is well suited to systems that need reliable glue logic, bus interfacing and control functionality in a small footprint.

Supported by the MachXO family architecture and design tools documented in the MachXO data sheet, this device offers a practical combination of integration, low-power standby options and field-update capabilities to reduce BOM complexity and simplify lifecycle updates.

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