LCMXO1200C-3FTN256C

The LCMXO1200C-3FTN256C is a MachXO family Field Programmable Gate Array (FPGA) offering 1200 logic elements, approximately 9.4 Kbits of on-chip RAM, and up to 211 I/O pins in a 256-ball BGA package. It delivers a non-volatile, instant-on FPGA architecture optimized for glue logic, bus bridging/interfacing, power-up control and general control logic in commercial applications.

As a single-chip, non-volatile solution the device supports rapid power-up, in-field reconfiguration and a flexible I/O buffer set, enabling compact, secure implementations where fast startup and integration density matter.

Key Features

• Logic Core 1200 logic elements (LUT-based) for implementing combinational and sequential logic; high I/O-to-logic density for glue-logic and interface functions.
• On-Chip Memory Approximately 9.4 Kbits of total on-chip RAM (embedded and distributed) to support small FIFOs, state machines and buffering.
• Non-Volatile, Instant-On Single-chip non-volatile configuration with instant-on power-up behavior and no external configuration memory required.
• Reconfiguration and Sleep In-field reconfiguration capability and Sleep Mode that can reduce static current by up to 100× for low-power standby.
• Flexible I/O Buffer Programmable I/O supporting a broad set of interfaces including multiple LVCMOS voltage levels, LVTTL, PCI and differential standards listed in the family datasheet.
• Clocking sysCLOCK PLL support as implemented in the MachXO family for clock multiplication, division and phase shifting (family-level capability).
• Voltage and Temperature Supports supply voltage range 1.71 V to 3.465 V and is rated for commercial operating temperatures from 0 °C to 85 °C.
• Package and Mounting Surface-mount 256-ball LBGA package (supplier device package: 256-FTBGA, 17×17) for compact board-level integration.
• Standards and System Support Family datasheet documents IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support; devices offer single-chip security advantages with no external bitstream to intercept.
• Compliance RoHS compliant packaging.

Typical Applications

• Glue Logic and Board-Level Control Replace discrete glue logic with a programmable single-chip solution for bus arbitration, address decoding and control-state machines.
• Bus Bridging and Interfacing Implement protocol adaptation and electrical interfacing between subsystem buses using the device’s high I/O count and programmable I/O buffers.
• Power-Up and Reset Control Execute deterministic power sequencing and reset management with instant-on behavior and non-volatile configuration.
• Peripheral and Sensor Control Coordinate sensors, displays and peripherals where compact integration and in-field reconfiguration are required.

Unique Advantages

• Single-Chip, Non-Volatile Configuration: Eliminates external configuration memory and delivers instant-on startup for quicker system readiness.
• High I/O Density with Compact Package: Up to 211 I/Os in a 256-ball BGA package simplifies routing and reduces PCB footprint for interface-heavy designs.
• Flexible Voltage Support: Operation across a broad supply range (1.71 V to 3.465 V) enables integration with multiple logic-voltage domains.
• Low-Power Standby: Sleep Mode capability can significantly reduce static current for power-sensitive applications.
• On-Device Memory and Clocking: Embedded and distributed RAM with family-level PLL support allow local buffering and flexible clock management without extra components.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.

Why Choose LCMXO1200C-3FTN256C?

The LCMXO1200C-3FTN256C positions itself as a compact, non-volatile MachXO FPGA ideal for designers who need instant-on behavior, flexible I/O and moderate logic density in a single-chip solution. Its combination of 1200 logic elements, roughly 9.4 Kbits of on-chip RAM and up to 211 I/Os in a 256-ball BGA package makes it well suited to board-level control, interface bridging and power-management tasks in commercial products.

Backed by the MachXO family architecture and design-tool support documented in the family datasheet, the device offers a pragmatic path to reduce BOM, simplify system start-up and enable in-field updates while maintaining compact board-level integration and RoHS-compliant packaging.

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