LCMXO1200C-3FT256C

IC FPGA 211 I/O 256FTBGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA

Quantity 107 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O211Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200C-3FT256C – MachXO FPGA, 1200 logic elements, 211 I/Os, 256-ball LBGA

The LCMXO1200C-3FT256C is a MachXO family Field Programmable Gate Array (FPGA) IC offering 1200 logic elements, 211 I/O pins, and 9,421 bits of on-chip RAM in a 256-ball LBGA package. It combines non-volatile instant-on behavior and reconfigurable FPGA-style logic to address board-level control, interface bridging, and power-up sequencing in commercial applications.

Optimized for glue logic, bus bridging and interfacing, and general control tasks, this surface-mount device supports a wide supply voltage range (1.71 V to 3.465 V) and operates across a commercial temperature range (0 °C to 85 °C). The part is RoHS compliant and shipped in a 256-FTBGA (17×17 mm) supplier package.

Key Features

  • Logic Capacity — 1200 logic elements suitable for glue logic, bus control, and mid-density programmable tasks.
  • I/O Density — 211 I/O pins to support complex board-level interfacing and multiple peripheral connections.
  • On-chip Memory — 9,421 bits of total RAM for distributed and embedded storage needs within target applications.
  • Non-volatile, Instant-on Architecture — MachXO family non-volatile configuration enables single-chip operation without external configuration memory and quick power-up behavior.
  • In-field Reconfiguration — Supports TransFR™ reconfiguration and background programming of non-volatile memory for in-system logic updates.
  • Programmable I/O Standards — Flexible sysIO buffer support for a wide range of interfaces, including multiple LVCMOS levels, LVTTL, PCI, LVDS variants, LVPECL and RSDS as defined in the MachXO family data.
  • Clocking — Includes a sysCLOCK PLL option (family table indicates one PLL for the 1200 device) for clock multiply/divide and phase shifting.
  • Package & Supply — 256-ball LBGA / supplier device package 256-FTBGA (17×17 mm); surface-mount with supply range 1.71 V to 3.465 V.
  • Commercial Grade & Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

  • Glue Logic — Replace discrete glue components with programmable logic for board-level signal routing, protocol adaptation, and timing control.
  • Bus Bridging & Interfacing — Implement bus translators and interface adapters leveraging 211 I/Os and flexible I/O standard support.
  • Power-up & System Control — Handle power sequencing, reset control and system supervision with non-volatile instant-on capability.
  • Control Logic — Implement device and subsystem control state machines, debouncing, and peripheral management without external configuration memory.

Unique Advantages

  • Single-chip non-volatile solution: Eliminates the need for external configuration memory while providing instant-on operation for faster system startup.
  • High I/O count in a compact package: 211 I/Os in a 256-ball LBGA (256-FTBGA, 17×17 mm) package enables dense board-level interfacing without larger packages.
  • Field-updatable logic: TransFR reconfiguration and background programming allow firmware updates and in-field logic changes with minimal system disruption.
  • Flexible voltage support: Operates across 1.71 V to 3.465 V supplies to accommodate diverse board power architectures.
  • Design tool support: MachXO series is supported by Lattice design flows (ispLEVER and related tools) to streamline synthesis, placement and timing for deployment.
  • Commercial-temperature rating: 0 °C to 85 °C operation for standard commercial applications.

Why Choose LCMXO1200C-3FT256C?

The LCMXO1200C-3FT256C blends CPLD-style non-volatile instant-on behavior with FPGA-style reconfigurable logic, making it well suited for designs that need reliable board-level control, interface bridging, and field-programmable updates. Its 1200 logic elements, substantial I/O count, and on-chip RAM provide a balanced mid-density solution that reduces external components and simplifies system architecture.

For engineers building commercial electronic systems that require quick startup, in-field update capability, and flexible I/O signaling, this MachXO device delivers an integrated, RoHS-compliant option backed by established MachXO family design resources.

If you would like pricing, availability, or a formal quote for the LCMXO1200C-3FT256C, submit a request or inquiry and our team will respond with the details you need.

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