LCMXO1200C-3FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA |
|---|---|
| Quantity | 107 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-3FT256C – MachXO FPGA, 1200 logic elements, 211 I/Os, 256-ball LBGA
The LCMXO1200C-3FT256C is a MachXO family Field Programmable Gate Array (FPGA) IC offering 1200 logic elements, 211 I/O pins, and 9,421 bits of on-chip RAM in a 256-ball LBGA package. It combines non-volatile instant-on behavior and reconfigurable FPGA-style logic to address board-level control, interface bridging, and power-up sequencing in commercial applications.
Optimized for glue logic, bus bridging and interfacing, and general control tasks, this surface-mount device supports a wide supply voltage range (1.71 V to 3.465 V) and operates across a commercial temperature range (0 °C to 85 °C). The part is RoHS compliant and shipped in a 256-FTBGA (17×17 mm) supplier package.
Key Features
- Logic Capacity — 1200 logic elements suitable for glue logic, bus control, and mid-density programmable tasks.
- I/O Density — 211 I/O pins to support complex board-level interfacing and multiple peripheral connections.
- On-chip Memory — 9,421 bits of total RAM for distributed and embedded storage needs within target applications.
- Non-volatile, Instant-on Architecture — MachXO family non-volatile configuration enables single-chip operation without external configuration memory and quick power-up behavior.
- In-field Reconfiguration — Supports TransFR™ reconfiguration and background programming of non-volatile memory for in-system logic updates.
- Programmable I/O Standards — Flexible sysIO buffer support for a wide range of interfaces, including multiple LVCMOS levels, LVTTL, PCI, LVDS variants, LVPECL and RSDS as defined in the MachXO family data.
- Clocking — Includes a sysCLOCK PLL option (family table indicates one PLL for the 1200 device) for clock multiply/divide and phase shifting.
- Package & Supply — 256-ball LBGA / supplier device package 256-FTBGA (17×17 mm); surface-mount with supply range 1.71 V to 3.465 V.
- Commercial Grade & Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.
Typical Applications
- Glue Logic — Replace discrete glue components with programmable logic for board-level signal routing, protocol adaptation, and timing control.
- Bus Bridging & Interfacing — Implement bus translators and interface adapters leveraging 211 I/Os and flexible I/O standard support.
- Power-up & System Control — Handle power sequencing, reset control and system supervision with non-volatile instant-on capability.
- Control Logic — Implement device and subsystem control state machines, debouncing, and peripheral management without external configuration memory.
Unique Advantages
- Single-chip non-volatile solution: Eliminates the need for external configuration memory while providing instant-on operation for faster system startup.
- High I/O count in a compact package: 211 I/Os in a 256-ball LBGA (256-FTBGA, 17×17 mm) package enables dense board-level interfacing without larger packages.
- Field-updatable logic: TransFR reconfiguration and background programming allow firmware updates and in-field logic changes with minimal system disruption.
- Flexible voltage support: Operates across 1.71 V to 3.465 V supplies to accommodate diverse board power architectures.
- Design tool support: MachXO series is supported by Lattice design flows (ispLEVER and related tools) to streamline synthesis, placement and timing for deployment.
- Commercial-temperature rating: 0 °C to 85 °C operation for standard commercial applications.
Why Choose LCMXO1200C-3FT256C?
The LCMXO1200C-3FT256C blends CPLD-style non-volatile instant-on behavior with FPGA-style reconfigurable logic, making it well suited for designs that need reliable board-level control, interface bridging, and field-programmable updates. Its 1200 logic elements, substantial I/O count, and on-chip RAM provide a balanced mid-density solution that reduces external components and simplifies system architecture.
For engineers building commercial electronic systems that require quick startup, in-field update capability, and flexible I/O signaling, this MachXO device delivers an integrated, RoHS-compliant option backed by established MachXO family design resources.
If you would like pricing, availability, or a formal quote for the LCMXO1200C-3FT256C, submit a request or inquiry and our team will respond with the details you need.

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